PCB科技 - PCB佈線要求

(1) Power supplies of different voltage levels should be isolated, 電源線不得交叉.
(2) The wiring adopts 4.5° corners or circular arc corners, 不允許有尖角.

(3) The 印刷電路板 跡線直接連接到焊盤的中心, 與襯墊連接的導線寬度不允許超過襯墊的外徑.
(4) The line width of the high-frequency signal line is not less than 20mil, 外部接地線用於將其包圍, 與其他地線隔離.
(5) Do not wire the bottom of the interference source (DC/直流變換器, 晶體振盪器, 變壓器, 等.) to avoid interference.
(6) Thicken the power line and ground line as much as possible, 如果空間允許，電源線的寬度不應小於50mil.
(7) The signal line width of low voltage and low current is 930mil, 如果空間允許，它應該盡可能厚.
(8) The spacing between signal lines should be greater than 10 mils, 電源線間距應大於20密耳.
(9) The line width of high-current signal lines should be greater than 40 mils, 間距應大於30密耳.
(10) The minimum size of the via hole is preferably 40 mil outside diameter and 28 mil inside diameter. 用電線連接頂層和底層時, 首選襯墊.
(11) It is not allowed to arrange signal lines on the inner 電力層.
(12) The width of the interval between different areas of the inner electrical layer shall not be less than 40 mils.
(13) When drawing the boundary, 儘量不要讓邊界線穿過要連接的區域的焊盤.
(14) Laying copper on the top and bottom layers, 建議將線寬值設定為大於網格寬度，以完全覆蓋空白空間，不留下死銅. 同時, keep a distance of more than 30mil (0.762mm) from other lines (copper can be used in the Set the safety distance before, and change it back to the original safety distance after the copper coating is completed).
(15) Teardrop the pad after wiring.
(16) The metal shell device and the external grounding of the module.
(17) Place the pads for mounting and soldering.
(18) The DRC check is correct.

4. 印刷電路板分層 requirements
(1) The power plane should be close to the ground plane, 與地平面緊密耦合, 並佈置在地平面下方.
(2) The signal layer should be adjacent to the inner electrical layer, 不直接與其他訊號層相鄰.
(3) 隔離數位電路 和類比電路. 如果條件允許, 類比信號線和數位信號線分層佈置，並採取遮罩措施； 如果它們需要佈置在同一訊號層上, 他們需要使用隔離帶和地線來减少干擾； 類比電路和數位電路的電源與接地應相互隔離，不得混合.
(4) The high-frequency circuit has a large external interference, 最好單獨安排, 並使用與內部直接相鄰的中間訊號層 電力層 上下傳動, 以便使用內部的銅膜 電力層 减少外部干擾.