PCBA科技 - PCBA項目成功的所有過程分析

Analysis of all 過程es for the success of the PCBA project
1. Preliminary preparation stage
1. PCBA項目規範, technical parameters and requirements;
2. 項目籌備領導小組, 負責工藝設計, 流程實施, 項目報告, 等.;
2. Design and development
The standard of this link is the circuit design ability that can meet the SMT生產 process.
3 設計和編輯作業指導書 SMT生產 process
1. 明確作業指導書的格式, 這與 PCBA加工 factory;
2. The content of the operation instruction is clear (the operation instruction for solder paste selection, 範本使用說明書, 補丁處理操作說明, 回流焊工藝控制說明, 等.);

4. Confirmation of steel mesh production capacity
1. The process of making steel mesh;
2. The patch processing factory exports Gerber files suitable for stencil production from PCB files to guide the process of stencil production;
5. Confirmation of the programming and operating capabilities of the placement machine
1. Evaluation of BOM list and Gerber documents;
2. 貼片機程式設計, PCB size measurement and board assembly processing;
Six, PCBA assembly test
1. Test after smt patch processing and production (aging, 燃燒, 訊號, 高溫和低溫, ICT測試, 等.);
2. 3防漆塗層, 等. (three-proof refers to which three-proof, please refer to our previous analysis of the problem);
Seven, PCBA patch project improvement and evaluation
1. PCBA設計 mutual inspection
2. Report
3. 改進建議