PCB科技 - PCB工藝PCB板清洗工藝詳細說明

PCB工藝 PCB板 cleaning process detailed explanation

1. Cutting: cutting a large sheet of 材料 into small pieces of 材料 needed

Wash board: Wash the dust and impurities on the board machine and air dry.
2 幹膜內層：在電路板的銅箔上粘貼一層感光材料, 然後用黑色膠片進行對準曝光和顯影，形成電路圖.
Chemical cleaning:
(1) Remove oxides, 垃圾, 等. 在銅表面； 如果銅表面粗糙, 它可以增强銅表面和光敏資料之間的結合力.
(2) Process: Degreasing-water washing-micro erosion-high 壓力 water washing-circulating water washing-water absorption-strong wind drying-hot air drying.
(3.) Factors affecting plate washing: degreasing 速度, 脫脂劑濃度, 微蝕刻溫度, 總酸度, Cu2+ concentration, pressure, speed.
(4) Defects are easy to produce: open circuit-poor cleaning effect, 導致丟膜； 短路髒汙清洗產生垃圾.
3. Immersion copper and board power

4. Outer dry film
5. 圖案電鍍：執行孔和電路電路，以完成鍍銅厚度要求.
(1) Degreasing: remove the 表面 oxide layer and surface pollutants;
(2) Acid leaching: remove pollutants in the pretreatment and copper tank;
6. 電路板電金：
（1）脫脂：去除電路圖表面的油脂和氧化物，以確保銅表面清潔。
7. Wet green oil:
(1) Pre-treatment: Remove the surface oxide film and roughen the surface to enhance the bonding force between the green oil and the 電路板 surface.
8. Tin spraying process:

(1) Hot water washing: clean the dirt and some ions on the surface of the 電路板;
(2) Scrubbing: further clean the residues left on the surface of the 電路板.
9. Immersion gold craft:
(1) Acidic degreasing: remove light grease and oxides on the copper surface to activate and clean the surface to form a surface state suitable for nickel and gold plating.
10. Shape processing
(1) Wash the board: remove surface contaminants and dust. 11. NETEK銅表面處理

（1）脫脂：去除電路圖表面的油脂和氧化物，以確保銅表面清潔。

Steps to clean the copper surface:
1. Dry film pressing
2. Before the inner layer oxidation treatment

3. After drilling (remove the slag, remove the colloid produced during the drilling process to make it coarser and clean) (mechanical grinding plate: use ultrasonic cleaning to fully clean the hole, and the copper powder and adhesion in the hole Sex particles are removed)
4. Before chemical copper
5. Before copper plating
6. Before the green paint
7. Before spraying tin (or other solder pad processing procedures)
8. Gold finger before nickel plating

Secondary copper pretreatment:
Degreasing-washing-micro-etching-washing-acid immersion-copper plating-washing the surface of the board surface impurities such as oxidation, 指紋, 以及可能遺留在先前工藝的外部電路製造廠表面上的微小物體. 並通過表面啟動, 使鍍銅附著力良好.
裝運前需要清潔以去除離子污染.

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