微波技術 - 電路板廠PCB高頻板選型及生產加工方法綜述

PCB高頻板定義

這個 high-frequency bo一rd 的 電路板 工廠指特殊 電路板 電磁頻率較高. It is used for high frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meter). 微波基板覆銅板 電路板採用部分普通剛性工藝生產 電路板 製造方法或使用特殊加工方法. 一般來說, a 高頻板 可以定義為 電路板 頻率在1GHz以上.

隨著科學技術的飛速發展, 越來越多的設備設計用於 微波頻段(>1GHZ) and even in the millimeter wave field (30GHZ). 這也意味著頻率越來越高, 以及 電路板 是對資料的要求越來越高. 例如, 基板資料需要具有優异的電力效能, 化學穩定性好, 並且隨著功率訊號頻率的新增，襯底上的損耗很小, 因此 高頻板 突出顯示.

2. PCB高頻板 application field ·

Mobile communication products; ·
Power amplifier, 低雜訊放大器, 等.;·
Passive components such as power splitters, 耦合器, 雙工器, 篩檢程式, 等.;
In the fields of automobile collision avoidance systems, 衛星系統, 和無線電系統, 高頻電子設備是一種發展趨勢.
第3, 的分類 高頻板s

Powder ceramic filled thermosetting 材料
A Manufacturer:

4350B/4003C from Rogers
Arlon's 25N/25FR
Taconic's TLG series
B. Processing method:
The processing process is similar to epoxy resin/glass woven cloth (FR4), 但這張紙比較脆，容易折斷. 鑽孔和敲鑼時, 鑽頭和鑼刀的壽命降低20%.

PTFE（聚四氟乙烯）資料

A. Manufacturer:
Rogers' RO3000 series, RT系列, TMM series
Arlon's AD/AR系列, IsoClad系列, CuClad series
Taconic's RF series, TLX系列, TLY series
Taixing Microwave's F4B, F4BM, F4BK, TP-2

B. Processing method:
1. Cutting: the protective film must be kept to prevent scratches and creasing

2. Drilling
1. Use a brand new drill tip (standard 130), 一個接一個是最好的, the pressure of the presser foot is 40psi
2. 鋁板是蓋板, and then the PTFE plate is tightened with a 1mm melamine backing plate
3. 鑽孔後, use an air gun to blow out the dust in the hole
4. Use the most stable drilling rig and drilling parameters (basically the smaller the hole, 鑽孔速度越快, 晶片負載越小, the smaller the return speed)

3. Hole treatment
Plasma treatment or sodium naphthalene activation treatment is conducive to hole metallization

4.PTH copper sink
1 After the micro-蝕刻 (the micro-etching rate has been controlled by 20 microinches), the PTH pulls from the de-oiler cylinder to enter the board
2 If necessary, 通過第二個PTH, just start the board from the expected cylinder

5. Solder mask
1 Pre-treatment: Use acidic plate washing instead of mechanical grinding plate
2 Baking plate after pretreatment (90 degree Celsius, 30min), brush with green oil to cure
3 Baking plates in three stages: one section at 80 degree Celsius, 100攝氏度, 和150攝氏度, each for 30 minutes (if you find oil on the substrate surface, you can rework: wash off the green oil and reactivate it)

6.Gong board
Lay the white paper on the circuit surface of the PTFE board, 並用FR-4基板或厚度為1的酚醛基板上下夾住.0毫米蝕刻以去除銅, as shown in the figure:
High-frequency board gong board stacking method
The burrs on the back of the gong board need to be carefully trimmed by hand to prevent damage to the substrate and copper surface, 然後用相當大尺寸的無硫紙分離, 並進行目視檢查. 减少毛刺, 關鍵是鑼板工藝必須有良好的效果.

第四，流程

NPTH's PTFE sheet processing flow
Cutting-Drilling-Dry Film-Inspection-Etching-Erosion Inspection-Solder Mask-Characters-Spray Tin-Forming-Testing-Final Inspection-Packaging-Shipment

PTH's PTFE plate processing flow
Cutting-drilling-hole treatment (plasma treatment or sodium naphthalene activation treatment)-copper immersion-board electricity-dry film-inspection-diagram electricity-etching-corrosion inspection-solder mask-character-spray tin-forming-test-final Inspection-Packaging-Shipping

五、總結

中的困難 高頻板加工
1. Immersion copper: the hole wall is not easy to be copper
2. 地圖傳輸線隙和沙眼的控制, etching, line width
3. 綠油工藝：綠油附著力, green oil foaming control
4. 各工序嚴格控制板面劃痕.