PCB科技 - 高可靠性PCB的十四個重要特性

的十四個重要特徵 高可靠性印刷電路板
1 2.5 micron hole wall copper thickness

benefit
Enhance 可靠性, 包括提高z軸的膨脹阻力.
The risk of not doing so
Blow holes or degassing, electrical connectivity problems during assembly (inner layer separation, hole wall fracture), 或在實際使用中負載條件下發生故障. IPCClass2 (這個 standard adopted by most factories) requires 20% less copper plating.
2. No welding repair or open circuit repair
benefit

完善的電路可以保證可靠性和安全性，無需維護，無風險。

The risk of not doing so
If repaired improperly, the 電路板 將被破壞. 即使修復是“適當的”, there is a risk of failure under load conditions (vibration, 等.), 可能導致實際使用失敗.
3. Exceeding the cleanliness requirements of IPC specifications
benefit
Improving 印刷電路板 清潔度可以提高可靠性.
The risk of not doing so
Residues and solder accumulation on the 電路板 給阻焊板帶來風險. 離子殘留物會在焊接表面造成腐蝕和污染風險, which may lead to reliability problems (bad solder joints/electrical failures) and ultimately increase the occurrence of actual failures. 可能性.

4. Strictly control the service life of each surface treatment
benefit
Solderability, reliability, 並降低水分侵入的風險.

The risk of not doing so
Due to the metallographic changes in the surface treatment of old 電路板s, 可能出現焊接問題, 水分侵入可能導致分層等問題, separation (open circuit) of the inner layer and the hole wall during the assembly process and/或實際使用. .

5、使用國際知名的基板，不要使用“本地”或未知品牌

benefit
Improve reliability and known performance

The risk of not doing so
Poor mechanical performance means that the 電路板 無法在程式集條件下執行預期效能. 例如, 高膨脹效能會導致分層, 斷開和翹曲問題. 電力特性减弱可能導致阻抗效能不佳.

6. 覆銅板的公差符合IPC4011CLASSB的要求/L
benefit
Strictly controlling the thickness of the dielectric layer can reduce the deviation of the expected electrical performance.

The risk of not doing so
The electrical performance may not meet the specified requirements, 和輸出/同一批組件的效能會有很大不同.

定義阻焊資料，以確保符合IPC-SM-840ClassT要求

benefit
NCAB Group recognizes "excellent" inks, 實現墨水安全, 並確保阻焊油墨符合UL標準.

The risk of not doing so
Inferior inks can cause adhesion, 磁通電阻, 和硬度問題. 所有這些問題都會導致阻焊板與 電路板 最終導致銅線腐蝕. 絕緣效能差可能會由於意外的電力連續性而導致短路/弧.

定義形狀、孔和其他機械特徵的公差

benefit
Strict control of tolerances can improve the dimensional quality of products-improve fit, 形狀和功能.

The risk of not doing so
Problems in the assembly process, 例如對齊/fitting (only when the assembly is completed will the press-fit needle problem be discovered). 此外, 由於尺寸偏差增大, 安裝底座時會出現問題.

NCAB規定了焊接掩模的厚度，儘管IPC沒有相關規定

benefit
Improve the electrical insulation properties, 降低剝離或附著力損失的風險, 無論在何處發生機械衝擊，都能增强抵抗機械衝擊的能力!

The risk of not doing so
Thin solder mask can cause adhesion, 磁通電阻和硬度問題. 所有這些問題都會導致阻焊板與 電路板 最終導致銅線腐蝕. 由於薄的焊接掩模，絕緣效能較差，可能會因意外導電而導致短路/弧.

定義了外觀要求和維修要求，但IPC未定義

benefit
Careful care and carefulness in the manufacturing process create safety.

The risk of not doing so
Various scratches, 輕傷，輕傷, 修理和修理 電路板 工作正常，但看起來不太好. 除了表面上可以看到的問題之外, 無形風險是什麼, 對裝配的影響, 以及實際使用中的風險?