精密PCB製造、高頻PCB、高速PCB、標準PCB、多層PCB和PCB組裝。
化學鎳金(ENIG)
Nickel gold is a relatively large surface treatment process. 鎳層為鎳磷合金層. 根據磷含量, 分為高磷鎳和中磷鎳. 應用程序不同.
The advantages of nickel-gold:
Suitable for lead-free soldering-->The surface is very flat, suitable for SMT-->Through holes can also be coated with nickel and gold-->Long storage time, storage conditions are not harsh-->Suitable for electrical testing-->Suitable for switch contact design -->Suitable for aluminum wire binding, 適用於厚板, 抗環境攻擊能力强.
2. 電鍍鎳金
電鍍鎳金分為“硬金”和“軟金”. Hard gold (such as goldcobalt alloy) is commonly used on gold fingers (contact connection design), 軟黃金是純金. 鎳和金電鍍廣泛應用於 IC基板(（如PBGA）). 主要適用於金、銅線的連接. 然而, IC基板的電鍍是合適的. 粘結金手指區域需要用額外的導線進行電鍍.
The advantages of electroplating nickel gold:
Long storage time>12 months-->Suitable for contact switch design and gold wire binding-->Suitable for electrical test
Weaknesses of nickel-gold electroplating:
Higher cost, thicker gold-->Additional design wire conductivity is needed when electroplating gold fingers-->Because the thickness of gold is not constant, 由於金太厚，可能導致焊點脆化，並影響焊接時的强度.--> The problem of surface uniformity of electroplating-->The electroplated nickel and gold do not cover the edge of the wire-->It is not suitable for aluminum wire bonding. Not suitable --> High storage conditions are required.
的優點和缺點 PCB電路板 tin spraying
Tin spraying was a common treatment in the early days of PCBs. 現分為鉛噴錫和無鉛噴錫.
The advantages of tin spraying:
Long storage time -->After the PCB is completed, the copper surface is completely wetted (the tin is completely covered before soldering)
Suitable for lead-free soldering-->Mature process-->Low cost-->Suitable for visual inspection and electrical measurement
Weaknesses of tin spraying:
-->Not suitable for wire bonding; due to surface flatness, there are limitations on SMT; not suitable for contact switch design --> Copper will dissolve when spraying tin, and the board will withstand a high temperature --> Especially thick or thin board, 噴錫有局限性, 生產操作不方便.
