PCB科技 - PCB電路板盲孔板生產知識

PCB電路板盲孔板生產知識

隨著電子行業產品向高密度、高精度方向發展, 相應地，對電路板提出了相同的要求. 提高密度的最有效方法 PCB電路板 是為了减少通孔的數量, and to accurately set the blind hole board (PCB電路板/circuit board) and buried holes to achieve it.

1 Definition of Blind Hole Circuit Board
a: In contrast to through holes, 通孔是指鑽穿各層的孔, 盲孔為非貫通孔. (Illustration, 示例 八層板：通孔, 盲孔，盲孔, buried holes) b: Blind hole subdivision: BLIND HOLE, BURIED HOLE (outer layer is not visible); c: From the production process Distinction: Blind holes are drilled before pressing, 壓制後鑽通孔.

2. Production method
1. Drill belt:
A: Select reference point: Select the through hole (ie a hole in the first drilled belt) as the unit reference hole.
B：每個盲孔鑽帶需要選擇一個孔, 並標記其相對於單元參攷孔的座標.
C：注意哪條鑽帶對應哪一層：必須標記組織子孔圖和鑽頭錶, 正面和背面的名稱必須相同； 子孔圖不能與abc一起顯示, 前一個用1st表示, 第二個條件.
請注意，當雷射孔與內埋孔套在一起時, 那就是, 兩條鑽帶的孔位於同一位置, 您需要讓客戶移動雷射孔的位置，以確保電力連接.

2. Production of pnl board edge process hole:
Ordinary 多層電路板: no drilling in the inner layer;
A: Rivets gh, aoi gh公司, et gh are all shot after eroding the board (beer out)
B: target hole (drilled hole gh) ccd: the outer layer needs to be copper out, x光機：直接打孔, 請注意，長邊的最小長度為11英寸.
盲孔板：所有工具孔均已鑽孔, 注意鉚釘gh； 需要外出以避免錯位. (（aoi gh也是一種啤酒）), pnl板的邊緣需要鑽孔以區分每個板.

3. Film modification:
1. Indicate that the film has a positive film and a negative film:
General principle: The board thickness is greater than 8mil (without copper), the positive film process is adopted;
The thickness of the board is less than 8mil (without copper) and the negative film process (thin board);
Line thickness When the line gap valley is large, d處的銅厚度/應考慮f, 不是底部銅厚度.
盲孔環可製成5英里, 無需製造7mil.
盲孔對應的內部獨立墊需要保留.
如果沒有環孔，則無法製作盲孔.

第四, the process:
The buried-hole board is the same as the common 雙面電路板.
盲孔板, 那就是, one side is the outer layer:
Positive film process: Single-sided d/f是必需的, and attention must be paid not to roll the wrong side (when the double-sided bottom copper is inconsistent); when d/f暴露, 光滑的銅質表面用黑色膠帶覆蓋，以防透光.
因為盲孔板做了兩次以上, 成品的厚度很容易過厚. 因此, 蝕刻後應控制板的厚度，並訓示銅厚度的範圍.
壓板後, 使用x光機沖出多層板的目標孔.
Negative film process: For thin plates (<12mil with copper) because it cannot be produced in the drawing circuit, 必須在取水時生產, 取水不能分為兩側, 囙此不能按照mi的要求製造. 小電流. 如果使用正片工藝, 一側的銅厚度通常太厚, 造成刻蝕困難和細線現象. 因此, 這種電路板需要使用負片工藝.

5. 通孔和盲孔的鑽孔順序不同, and the deviation is inconsistent during production
Blind hole plates are more prone to deformation, 並且很難打開水准和直線材質來控制多層板對齊和管間距. 因此, 切割時僅打開水准或直材質.

六, Laser drill
LASER DRILL is a kind of blind hole with its own characteristics:
Aperture size: 4-6 mil
pp thickness must be <=4.5mil, calculated according to aspect ratio<=0.75:1
There are three types of pp: LDPP 106 1080; FR4 106 1080; RCC.

七, how to define the buried hole plate needs to use resin plug hole
1. H1 (CCL): H2 (PP) € =4 thickness ratio
2. HI (CCL) €‹32 MIL
3.2OZ及以上2OZ雷射埋通孔； 高厚銅, 高tg板需要用樹脂密封.
對於此類板的登機流程, 在製作電路之前，應注意用樹脂密封孔，以免對電路造成更大的損壞.

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