製作PCB板時各層的作用和介紹

2021-09-19

Author：Kavie

頂部 LAYER (top wiring layer):
Designed as the top copper foil trace. 如果是單面板, 沒有這樣的層.
2. BOMTTOM LAYER (bottom wiring layer):
Designed as the bottom copper foil trace.
3. 頂部/BOTTOM SOLDER (top/bottom solder mask green oil layer):
Put solder mask green oil on the top/底層防止銅箔上錫並保持絕緣. 在焊盤處用阻焊板打開視窗, 該層上的過孔和非電痕.
在設計中, the soldering pad will open a window by default (OVERRIDE: 0.1016.mm), 那就是, 焊盤露出銅箔並膨脹0.1016mm, 波峰焊時會鍍錫. It is recommended not to make design changes to ensure solderability;
In the design of the via hole, the window will be opened by default (OVERRIDE: 0.1016mm), 那就是, 通孔露出銅箔並膨脹0.1016mm, 波峰焊時會鍍錫. 如果設計是為了防止過孔上的錫，而不是暴露銅, you must check the PENTING option in the additional properties of the vias SOLDER MASK (solder mask opening) to close the via opening.
此外, 該層也可單獨用於非電力佈線, 焊料掩模綠色油會相應地打開視窗. 如果是銅箔痕迹, 用於增强跟踪的過流能力, 焊接時加錫；如果在非銅箔痕迹上, 一般用於標誌和特殊字元絲網印刷, 可以省略. 字元絲印層.
4. 頂部/BOTTOM PASTE (top/bottom solder paste layer):
This layer is generally used to apply solder paste during the SMT reflow soldering process of SMT components, 與印製板製造商的電路板無關. 匯出GERBER時可以將其删除, 以及 PCB板設計 可以保留預設值.
5. TOP/BOTTOM OVERLAY (top/bottom screen printing layer):
Designed as a variety of silk screen logos, 例如組件編號, 角色, 商標, 等.
6. MECHANICAL LAYERS (mechanical layer):
Designed as the mechanical shape of the PCB板, 默認圖層1是形狀圖層. 其他層2/3/4, 等. 可用於機械尺寸標記或特殊用途. 例如, 當某些電路板需要由導電碳油製成時, 第2層/3/4, 等. 可以使用, 但必須在同一層上清楚標記該層的用途.
7 KEEPOUT LAYER (prohibited wiring layer):
The design is to prohibit the wiring layer. 許多設計師還使用 PCB板. 在製作 PCB板, 有禁止層和機械層1. 主要考慮的是兩層的完整性. 通常地, 以機械層1為准. 設計時建議使用機械層1作為造型層. 如果使用禁止層作為形狀, 不要使用機械層1以避免混淆!
8 MIDLAYERS (middle signal layer):
It is mostly used for multi-layer boards, 但我們的設計很少使用. 它也可以用作專用層, 但必須在同一層上清楚標記該層的用途.
9. INTERNAL PLANES:
It is used for multi-layer boards, 我們公司的設計中沒有使用.
10. MULTI LAYER (via layer):
Via-hole pad layer.
11. DRILL GUIDE (drilling positioning layer):
Position the coordinate layer at the center of the pad and the hole of the via hole.
12. DRILL DRAWING (drilling description layer):
The description layer of the hole diameter size of the pad and the via hole.