PCB科技 - PCB孔板和焊接掩模設計要點

PCB hole plate and solder mask design essentials
1. 孔板設計 PCB加工
穿孔圓盤設計, 包括設計各種類型的帶有金屬化孔和非金屬化孔的磁片, 這些設計與PCB的處理能力有關.
薄膜和資料在 PCB生產, 不同資料在壓制過程中的膨脹和收縮, 圖形傳遞和鑽孔的位置精度, 等. 將導致各層圖案之間的對齊不準確. 為了確保各層圖案的良好互連, 墊環的寬度必須考慮層間圖案對齊公差的要求, 有效絕緣間隙與可靠性. 體現在設計上的是控制墊環寬度.
(1) The metalized hole pad should be greater than or equal to 5mil.
(2.) The width of the insulation ring is generally 10mil.
(3) The width of the anti-pad ring on the outer layer of the metallized hole should be greater than or equal to 6mil, 這主要是考慮到焊接掩模的需要而提出的.
(4) The width of the anti-pad ring in the inner layer of the metallized hole should be greater than or equal to 8mil, 主要考慮絕緣間隙的要求.
(5) The anti-pad ring width of non-metallized holes is generally designed as 12mil.
2. 焊接掩模設計 PCB 處理

最小阻焊板間隙, 最小阻焊板橋寬度, 最小N覆蓋擴展尺寸取決於焊接掩模圖案轉移方法, 表面處理工藝及銅厚度. 因此, 如果您需要更精確的焊接掩模設計, 你需要知道 PCB板 工廠.
(1) Under the condition of 1OZ copper thickness, 阻焊板間隙大於或等於0.08mm (3mil).
(2) Under the condition of 1OZ copper thickness, 阻焊板橋的寬度大於或等於0.10mm (4mil). 由於lm-Sn溶液對某些阻焊劑有侵蝕作用, 當使用lm-Sn的表面處理時，需要適度新增阻焊橋的寬度, 最小值一般為0.125mm (5mil).
(3) Under the condition of 1OZ copper thickness, the minimum expansion size of the conductor Tm cover is greater than or equal to
The solder mask design of the via hole is an important part of the manufacturability design of PCBA processing. 是否塞孔取決於工藝路徑和過孔的佈局. 9 A& m9 B. Z0 C
(1) There are three main methods for solder mask of via holes: plug hole (including half plug and full plug), 打開小視窗和全視窗.
(2) Solder mask design of via holes under BGA
For the solder mask of the BGA dog bone connection via hole, 我們更喜歡塞孔設計. 這有兩個優點. 一是BGA再流焊時，由於掩模偏移，不易橋接； 另一種情况是，如果BGA的底面直接通過波峰, 可减少波峰焊時的釺焊和釺焊, 而且斑點很重. 熔化, 影響可靠性.