PCB科技 - 高精度八層pcb電路板加工流程

處理流程 高精度八層PCB電路板:

Eight-layer 覆銅板 消隱, 鑽孔基準孔, CNC通孔鑽孔, 視察, 去毛刺, 疾馳的, electroless plating (through hole metallization), 全板電鍍薄銅, 視察, 疾馳的, 以及負電路圖案的絲網印刷, Curing (dry film or wet film, 面臨, 發展), 視察, 修復, 電路圖案電鍍, tin electroplating (anti-corrosive nickel/gold), printing 材料 (photosensitive film), 銅蝕刻, 錫剝離, 打掃, 疾馳的, and mesh Soldering resist graphics (sticking photosensitive dry film or wet film, 面臨, development, 熱固化, commonly used photosensitive 這個rmal curing green oil) ~ 打掃, 乾燥絲網印刷標記字元圖形, 固化成型加工, cleaning, 乾燥電力通信中斷檢查, 噴錫或有機阻焊膜, 檢查包裝, 並留下成品.

就流程而言, the high-precision eight-layer PCB電路板: printed circuit boards with patterns that have been made - acid degreasing - scanning water washing - secondary countercurrent washing - micro-etching - scanning water washing - secondary countercurrent washing - copper plating Dipping - copper plating - scanning water washing - tinning prepreg - tin plating - secondary countercurrent washing - lower board

There are vias and blind vias above eight layers. 通孔從頂層到底層打開. 盲孔僅在頂層或底層之一可見, 另一層是不可見的, 那就是, 盲孔，盲孔. 從表面鑽孔, 但不是通過所有層. 還有另一種叫做埋藏通道. 埋入式過孔是指內層的過孔, 表層和底層是不可見的. The advantage of making buried vias and blind vias is that it can increase the wiring space

八層PCB電路板 接線管道：一般, 八層 PCB電路板 可分為頂層, 一層底層和兩層中間層. 頂層和底層用訊號線佈線. 中間層首先通過命令設計將INTERNALPLANE1和INTERNALPLANE2與ADDPLANE相加/LAYERSTACKMANAGER as the most used power layer such as VCC and ground layer such as GND (that is, 連接相應的網絡標籤.

小心不要使用ADDLAYER，這會新增MIDPLAYER，它主要用於多層訊號線放置），

這樣，PLNNE1和PLANE2是連接電源VCC和接地GND的兩層銅。