PCB科技 - 剛柔電路板加工技術

顧名思義, 剛柔印刷電路板 進行剛性和 撓性電路板. 然後，兩塊電路板永久互連，形成各種類型的PCB. 在製造過程中 剛柔電路板, 為了生產出完美的最終產品，必須考慮某些因素和精度.
Some of the more important considerations are:
l Laser contour cutting
l Selective pad plating
l Material size tolerance
l Thin 材料 handling capacity and procedures, and
l Plasma decontamination and etchback
Compared with traditional 剛性PCB, 用於製造的柔性基材 剛柔PCB 擁有更多優勢. they are:
l Lighter weight
l can be used to interconnect components,
l Smaller thickness
l Dynamic bending
l Save more space,
l具有優异的電力和熱效能,
我只是舉幾個例子, 它在電子設計和機械設計方面具有高度的自由度.

The steps involved in the rigid Flex design and manufacturing process
1. Preparation of basic 材料:
The first step in the rigid-flex manufacturing process is to prepare/清潔層壓板. The laminate contains a copper layer (with an adhesive coating) and must be thoroughly cleaned before proceeding to the next step. 大體上, 預清洗是為了去除供應商用於防止氧化的銅線圈的防銹層. 去除塗層, the manufacturer performs the following steps:
l First, 將銅線圈浸入濃酸溶液中.
l過硫酸鈉處理用於微蝕刻銅線圈.
l Use a suitable oxidizer to coat the copper coils to provide adhesion and anti-oxidation protection
2. Circuit pattern generation
After preparing the basic 材料, 下一步是生成電路圖案. This is done using two main techniques:
l Screen printing: This is the most popular technology. 它直接在層壓板表面上創建所需的圖案. 最大總厚度為4-50微米.
l攝影成像：這項科技是最古老的科技, 通常用於描述層壓板上的電路跡線. 使用乾燥的光刻膠膜和紫外光將圖案從光掩模轉移到層壓板.
3. Etching the circuit pattern
After generating the desired pattern, 然後仔細蝕刻銅板. 此過程可通過將層壓板浸入蝕刻槽或將其暴露於蝕刻劑噴霧中來完成. 為了獲得完美的結果, 層壓板的兩側必須同時蝕刻.
4. Drilling process
High-speed tools with 100% accuracy can be used to make a large number of holes, 襯墊和通孔. 超小孔採用雷射打孔科技.
5. Through hole plating
This process is very precise and careful. 鑽孔用銅精確沉積並化學鍍以形成電互連層.
6. 塗抹覆蓋層或覆蓋層.
覆蓋層用於保護剛柔電路板的頂面和底面. 其主要目的是為電路板提供全面保護，使其免受惡劣物理和化學條件的影響. 通常使用聚醯亞胺薄膜，並使用絲網印刷科技將其壓印在表面上.
7. 小心地切斷彎曲部分，切斷並卸載一根 柔性PCB板. 對於 PCB批量生產, 採用液壓鑽孔, 而專用刀具用於小批量生產.
8. 電力測試和驗證.
測試和驗證是最後也是最後一步. 的完整性 剛柔電路板 必須進行評估, 因為即使是最輕微的缺陷也會嚴重影響功能, 最終剛性和柔性電路的效能和耐久性.