PCB科技 - 封裝術語解釋

Explanation of IC packaging terms (1)
1. BGA (ball grid array)
A display of spherical contacts, 其中一個表面貼裝封裝. 印刷品背面 電路板, spherical bumps are made according to the display method for
Instead of pins, LSI晶片安裝在印刷電路板的正面 電路板, 然後用模制樹脂或灌封密封. Also called convex
Point display carrier (PAC). 引脚可超過2.00, 這是一個用於多引脚LSI的封裝.
包裝體也可以小於 QFP (（方形扁平封裝）). 例如, 3.6.0個銷，銷中心距為1.5.毫米
BGA is only 31mm square; while the 304.-pin QFP 銷中心距離為0.5毫米為40毫米正方形. And BGA doesn’t
Worry about pin deformation like QFP.
該套裝軟體由美國摩托羅拉公司開發. 它首先被用於可擕式電話和其他設備, 並將於未來在美國上市.
可以在個人電腦中普及. 開始, the BGA pin (bump) center distance was 1.5毫米, 引脚數量為225個. Now also
一些 LSI manufacturers are developing 500-pin BGAs.
BGA的問題是回流焊後的目視檢查. 現時尚不清楚是否有有效的目視檢查方法. 一些人認為,
由於焊接中心距大, 連接可視為穩定，只能通過功能檢查進行處理.
美國摩托羅拉公司將模壓樹脂密封的包裝稱為OMPAC, and the package sealed by potting method is called
GPAC (see OMPAC and GPAC).

2. BQFP (quad flat package with bumper)
Four-side pin flat package with cushion. 其中一個 QFP 包裝. Protrusions (buffer pads) are provided at the four corners of the package body to
Prevent bending and deformation of the pins during transportation. 美國人 電晶體 manufacturers mainly use microprocessors and ASICs in circuits
This package. 銷中心距離為0.635mm, and the pin number is about 8.4 to 196 (see QFP).

3. Butt welding PGA (butt joint pin grid array)
的其他名稱 surface mount PGA (see surface mount PGA).

4. C-(ceramic)
Indicates the mark of 陶瓷 package. 例如, CDIP代表陶瓷浸漬. 這是一個經常在實踐中使用的標記.

5. Cerdip
Ceramic dual in-line package sealed with glass, 用於ECL RAM, DSP (digital signal processor) and other circuits. With
Cerdip of glass window is used for ultraviolet erasable EPROM and microcomputer circuit with EPROM inside. Pin Center
The distance is 2.54毫米, 引脚數量為8到42. 在日本, this package is expressed as DIP-G (G means glass seal).

6. 賽誇德
其中一個表面貼裝封裝, the ceramic QFP 密封條件下, 用於封裝邏輯LSI電路，如DSP. 帶視窗
賽誇德 用於封裝EPROM電路. 散熱性比塑膠好 QFP, 它可以承受1.5under natural air cooling conditions
2W power. 但包裝成本是塑膠的3到5倍 QFP. 銷中心距離為1.27.毫米, 0.8毫米, 0.65毫米, 0.5mm,
各種規格，如0.4毫米. 引脚數量從32到368不等.

7. CLCC (ceramic leaded chip carrier)
A ceramic chip carrier with pins, 其中一個表面貼裝封裝. 銷從包裝的四個側面拔出，呈T形.
用於紫外可擦除EPROM和微機電路的windows封裝. This package is also called
QFJ, QFJ-G (see QFJ).

8. COB (chip on board)
Chip-on-board packaging is one of the bare chip mounting technologies.
電路板的電力連接是通過線縫合的方法實現的, 晶片與基板之間的電連接是通過線縫合的方法實現的, 它被樹脂覆蓋著.
保護以確保安全. 雖然COB是最簡單的裸晶片安裝科技, its packaging density is far inferior to TAB and rewind
Welding technology.

9. DFP (雙平面封裝)
Double-sided lead flat package. It is another name for SOP (see SOP). 以前有這個詞, 但現在基本上沒有使用.

10. DIC (dual in-line ceramic package)
Another name for ceramic DIP (including glass seal) (see DIP).

11. DIL (dual in-line)
Another name for DIP (see DIP). 歐洲的 電晶體 製造商通常使用此名稱.

12. DIP (dual in-line package)
Dual in-line package. 其中一個外掛程式包, 引脚從包裝的兩側抽出, 包裝材料為塑膠和陶瓷.
DIP是最流行的挿件套裝軟體, 其應用範圍包括標準邏輯IC, 記憶體LSI, 和微型電腦電路.
銷中心距離為2.54毫米, 引脚數從6到64. 包裝寬度通常為15.2毫米. 有些寬度為7.52mm
And the 10.16mm packages are called skinny DIP and slim DIP (narrow DIP) respectively. 但在大多數情况下, 沒有區別.
簡稱DIP. 此外, ceramic DIP sealed with low-melting glass is also called cerdip (see cerdip).

13. DSO (dual small out-lint)
Two-sided lead small outline package. Another name for SOP (see SOP). 一些 電晶體 製造商使用此名稱.

14. DICP (dual tape carrier package)
Two-sided lead-carrying package. One of TCP (Tape Carrier Package). 引脚製作在絕緣帶上，並從封裝的兩側引出. Due to benefit
It uses TAB (automatic tape load welding) technology, 而且包裝外形很薄. 它常用於液晶顯示驅動器LSI中, 但大多數都是定制產品.
此外, the 0.5mm厚記憶體LSI書籍包處於開發階段. 在日本, according to EIAJ (Electronic Mechanics of Japan)
The industry association standard stipulates that DICP is named DTP.

15. DIP (dual tape carrier package)
Same as above. The Japanese Electronic Machinery Industry Association standard names DTCP (see DTCP).

16, FP (flat package)
Flat package. 表面貼裝封裝之一. Another name for QFP or SOP (see QFP and SOP). Some 電晶體 manufacturers adopt
Use this name.

17, flip-chip
Flip-soldering the chip. 裸晶片封裝科技之一, 在LSI晶片的電極區域製作金屬凸點, and then the metal bumps
It is connected to the electrode area on the printed 電路板 通過壓力焊接. 封裝的封裝外形與晶片尺寸基本相同. Is all packaging technology
The smallest and thinnest type in surgery.
然而, 如果基板的熱膨脹係數與LSI晶片的熱膨脹係數不同, 接合處會有反應, 這將影響連接的可靠性.
性別. 因此, 有必要使用樹脂來加固LSI晶片, 並使用熱膨脹係數基本相同的基材.

18. FQFP (fine pitch quad flat package)
Small pin center distance QFP. 通常指 QFP 領先中心距離小於0.65mm (see QFP). Part of the conductor manufacturer adopts
Use this name.

19. CPAC (globe top pad array carrier)
American Motorola Company's nickname for BGA (see BGA).

20, CQFP (quad fiat package with guard ring)
Four-side lead flat package with guard ring. 其中一個塑膠 QFPs, 銷用樹脂保護環遮蓋，以防止彎曲和變形.
Before assembling the LSI on the 印刷電路板, cut the lead from the guard ring and make it into a seagull wing shape (L shape). This package
It has been mass-produced by Motorola in the United States. 銷中心距離為0.5mm, 引脚數量最多約208個.

21, H-(with heat sink)
Indicates a mark with a radiator. 例如, HSOP表示帶散熱器的SOP.

22, pin grid array (surface mount type)
Surface mount PGA. 通常，PGA是一種插腳長度約為3的插入式封裝.4毫米. Surface mount PGA in the package
There are display-like pins on the bottom, 其長度從1開始.5mm至2.0mm. Mounting uses the method of touch-welding with the 印刷電路板, so it is also called
For butt welding PGA. 因為銷中心距離只有1.27毫米, 比插入式PGA小一半, 包裝主體可採用不同的製造管道.
多大, and the number of pins is more than that of the plug-in type (250528), 它是用於大規模邏輯LSI的封裝. The encapsulated substrate has multilayer ceramics
Porcelain substrate and glass epoxy resin printing base. 多層陶瓷基板的封裝已投入實際應用.

23, JLCC（J-引線晶片載體）
J形銷晶片載體. Another name for CLCC with window and ceramic QFJ with window (see CLCC and QFJ). Part and half
The name adopted by the conductor manufacturer.

24, LCC (Leadless chip carrier)
Leadless chip carrier. 指表面貼裝封裝，其中陶瓷基板的四個側面僅與無引線的電極接觸. 是高的
高速和高頻IC封裝, also known as ceramic QFN or QFN-C (see QFN).

25, LGA (land grid array)
Contact display package. 那就是, 在底部表面製作具有陣列狀態電極觸點的封裝. 組裝時只需插入插座. Now
Practical ceramic LGA with 227 contacts (1.27mm center distance) and 447 contacts (2.54毫米 center distance) for high-speed logic
LSI circuit.
和…比起來 QFP, LGA可以在更小的封裝中容納更多的輸入和輸出引脚. 此外, due to the impedance of the lead
Small, 非常適合高速LSI. 然而, 由於插座生產複雜，成本高, 現在基本上沒有太多使用. Expected
Its demand will increase in the future.

IC封裝術語解釋（2）

26, LOC (lead on chip)
Lead-on-chip packaging. LSI封裝技術之一, 引線框架前端位於晶片上方的一種結構, and the chip’s
Protruding solder joints are made near the center, 電力連接採用線迹. Compared with the original lead frame placed near the side of the chip
Compared with the structure, 相同尺寸封裝中的晶片寬度約為1mm.

27, LQFP (low profile quad flat package)
Thin QFP. 指的是 QFP 包裝體厚度為1.4mm, 這是一個新的 QFP formulated by the Japanese Electronic Machinery Industry Association
The name used for the form factor.

28, L-QUAD
One of ceramic QFP. 用於封裝基板的氮化鋁的熱導率是氧化鋁的7-8倍, 散熱性更好.
包裝的框架是氧化鋁, 晶片通過封裝密封, 從而降低成本. 是為邏輯LSI開發的包,
自然風冷條件下的允許W3功率. 208-pin (0.5mm center distance) and 160-pin (0.65mm
Center distance) LSI logic package, 1993年10月開始批量生產.