PCB新聞 - PCB電路板散熱

PCB電路板散熱

電子設備工作時, 產生的熱量將導致設備內部溫度迅速升高. 如果沒有及時散熱, 設備將繼續加熱, 設備將因過熱而發生故障, 電子設備的可靠性會降低. 因此, 對其進行散熱處理非常重要 PCB板 的 PCB電路板製造商.

1 溫度上升因素分析 印刷電路板
溫度升高的直接原因 PCB板 是由於電路中存在功耗器件, 電子設備都有不同程度的功耗, 加熱强度隨耗電量的大小而變化.
中的兩種溫昇現象 印刷電路板:
(1) Local temperature rise or large area temperature rise;
(2) Short-term temperature rise or long-term temperature rise.
在分析PCB的熱功耗時, 一般從以下幾個方面進行分析.

1. Electrical 權力 consumption
(1) Analyze the power consumption per unit area;
(2) Analyze the distribution 屬於 power consumption on the PCB.
2. The structure of the printed circuit board
(1) The size of the printed circuit board;
(2) Materials for 印刷電路板.
3 Installation method of printed circuit board
(1) Installation method (such as vertical installation, horizontal installation);
(2) The sealing condition and the distance from the casing.
4 Heat conduction
(1) Install the radiator;
(2) Conduction of other installation structural parts.
5 Thermal radiation
(1) The radiation coefficient on the surface of the printed circuit board;
(2) The temperature difference between the printed circuit board and adjacent surfaces and their absolute temperature;
6 Thermal convection
(1) Natural convection;
(2) Forced cooling convection.
從PCB電路板打樣廠家分析上述因素是解决印製板溫昇的有效途徑. 在產品和系統中，這些因素往往相互關聯和依賴. 大多數因素應根據實際情況進行分析. 根據具體實際情況, 可以更準確地計算或估計溫昇和功耗等參數.

2. Circuit board heat dissipation method
1. High heat-generating device plus radiator and heat conduction plate
When a small number of components in the PCB circuit board generate a large amount of heat (less than 3), 可以在加熱部件中添加散熱器或熱管. 當溫度無法降低時, 可以使用帶風扇的散熱器來增强散熱效果. When the number of heating devices is large (more than 3), large
The heat dissipation cover (board), 根據PCB上加熱裝置的位置和高度定制的專用散熱器, 或在大型扁平散熱器上切割出不同的部件高度位置. 散熱蓋整體扣合在部件表面, 它與每個部件接觸以散熱. But because of the components
The consistency of height during welding is poor, 散熱效果不好. 通常, 在構件表面添加軟質熱相變熱墊，提高散熱效果.
2. Use reasonable wiring design to realize heat dissipation
Because the resin in the plate has poor thermal conductivity, 銅箔線和孔是熱的良導體, 提高銅箔的殘留率和新增導熱孔是主要的散熱手段.
評估PCB電路板的散熱能力, it is necessary to calculate the equivalent thermal conductivity (nine eq) of the composite 材料 composed of various 材料 with different thermal conductivity-the insulating substrate for the PCB circuit board.

3. Heat dissipation through the PCB circuit board itself
At present, 廣泛使用的PCB電路板為覆銅板/環氧玻璃布基材或酚醛樹脂玻璃布基材, 使用少量紙基覆銅板. 雖然這些基板具有優异的電學效能和加工效能, 散熱性差. 作為高發熱元件的散熱管道,
幾乎不可能指望PCB本身的樹脂傳導熱量, 而是將部件表面的熱量散發到周圍的空氣中. 然而, 隨著電子產品進入元器件小型化時代, 高密度安裝, 和高熱組件, 僅依靠表面積非常小的部件表面散熱是不够的.
of. 同時, 由於QFP和BGA等表面貼裝組件的大規模使用, 元件產生的熱量大量傳遞到PCB電路板. 因此, 解决散熱問題的最佳方法是提高與加熱元件直接接觸的PCB本身的散熱能力. 董事會傳導或輻射.
4. 將功耗和產熱量最高的設備佈置在最佳散熱位置附近. 請勿在印製板的角部和周邊邊緣放置高熱設備, 除非附近有散熱器. 設計功率電阻器時, 盡可能選擇更大的設備, and
When adjusting the printed board layout, 使其有足够的散熱空間.
5. 同一印製板上的設備應盡可能根據其熱值和散熱程度進行佈置. Devices with small calorific value or poor heat resistance (such as small signal transistors, 小型集成電路, 電解電容, 等.) should be placed The uppermost flow (at the entrance) of the cooling airflow, which generates a large amount of heat or
Devices with good heat resistance (such as power transistors, 大規模集成電路, 等.) are placed at the most downstream of the cooling airflow.
6. The temperature-sensitive device is best placed in the lowest temperature area (such as the bottom of the device). 切勿將其直接置於加熱裝置上方. 最好在水平面上錯開多個設備.

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