PCB科技 - 改進的階梯電路板生產工藝

改進的階梯式 PCB板 生產過程, 其特徵在於，其包括上基板, 至少一個中間基板和一個下部基板. The process flow is as follows: (1) Cutting: the upper substrate, 根據要求切割中間基板和下部基板. Need to be cut to size; (2) Inner layer: the lower surface of the upper substrate, 下基板的上表面和中間基板的前後通過影像轉移形成電路圖案, 和 then the unnecessary part of the copper foil is processed by a milling machine Removal to form the required loop pattern; then use a molding machine to fish the middle substrate to create a window corresponding to the position 和 size on the middle substrate; (3) once drilling: the upper substrate, the middle substrate and the lower substrate Aligning pin holes are drilled on the substrate; (4) Resin printing: The alignment pin holes drilled on the upper, middle and lower substrates are selectively plugged with resin by printing; (5) Pressing: in Place the film between the upper substrate and the middle substrate and between the middle substrate and the lower substrate and stack them one by one, 使用定位銷將它們對齊, and send them into a vacuum laminator to harden and bond the films together to form 多層PCB板;

Then, 在需要進行步驟的位置, 上基板由成型機以固定深度切割, exposing the upper surface circuit pattern of the lower substrate; (6) Secondary drilling: Drilling on the 多層PCB板 by using different specifications of slot cutters Slot holes of the required size; (7) Plating: Copper is plated on the outer surface of the 多層PCB板 通過化學反應在槽中, so that the slots can conduct between the layers; (8) Dry film : Cover a layer of dry film on the outer surface of the copper 多層PCB板, and form a circuit image on the outer surface of the copper 多層PCB板 through image transfer; (9) Alkaline 等hing: useless chemical reaction The copper foil is removed to obtain an independent and complete outer layer circuit; (10) Solder protection: a layer of ink is covered on the outer surface of the 多層PCB板 by printing; (11) Printing: on the 多層PCB板 by printing Corresponding symbols are printed on the outer surface; (12) Forming: The whole piece of 多層 PCB板 從無用的框架中删除, 然後進行化學清洗，然後將其分類為指定的形狀和規格.
Know the foundry you are using
After discussing DRC settings, 這種技術幾乎是多餘的，但並非完全多餘. 除了幫助您正確製定DRC規則之外, 知道您的PCB將被發送到哪個鑄造廠也可以提供一些額外的製造前協助. 一個好的鑄造廠會在你下訂單之前提供一些有用的幫助和建議, 包括如何改進設計以减少設計反覆運算, 减少在測試臺上進行最終調試時遇到的問題, 並提高 PCBA.
雨果, 卡內基梅隆大學博士生, 在他的部落格中評論了他對製造商的瞭解：“每個製造商都有自己的規格, 例如最小導線寬度, 間距, 層數, etc 開始設計之前, 你應該考慮好自己的要求, 然後找一家能滿足你要求的製造商. 您的要求還包括 PCB資料. 等級 PCB資料 ranges from FR-1 (paper-phenolic resin mixture) to FR-5 (glass fiber and ring). Oxygen resin). 最 PCB原型製造商 使用FR-4, 但FR-2也經常用於大批量消費應用中. 資料類型會影響强度, 耐久性, moisture absorption and flame retardancy of the PCB (FR )."
Understanding the manufacturing process of printed PCB and knowing which process and method your manufacturer will use can help you make better design decisions. 拜訪您選擇的供應商，瞭解自己的製造過程. Make good use of DFM (design for manufacturability) tools before submitting your design to manufacturing.
Summary of this article
If you are thinking about these basic skills and techniques, 這意味著你已經走上了快速發展的道路, 可信賴的, and 專業質量PCB. 瞭解製造過程； 使用DRC和DFM幫助您抓住可能會新增鑄造成本和/或降低產量. 然後仔細規劃組件的佈局，以消除昂貴的設計功能. 明智地使用CAD工具提供的所有設計工具, 包括自動佈局和自動佈線, 但是，為了獲得良好的自動佈線效果，您必須耐心徹底地設定自動佈線設備.
除佈線外，不要依賴自動路由器； 需要時手動調整導線尺寸，以確保設計承載正確的電流. 不管怎樣, 你必須相信飛行的線索, 直到所有飛行線索100%消失, 您的PCB設計可以認為是完整的. 後者 PCB打樣 and PCB板 生產可以更加省時省力.