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PCB新聞 - PCB設計中的PCB佈線檢測

PCB新聞

PCB新聞 - PCB設計中的PCB佈線檢測

PCB設計中的PCB佈線檢測

2021-11-04
View:545
Author:Kavie

1) Is the wire short and straight without sacrificing functionality?
2) Did you comply with the restrictions on wire width?
3) Between the wires, 導線和安裝孔之間, 在電線和襯墊之間是否有必須保證的最小導線間距?
4) Have you avoided all the wires (including component leads) that are relatively close in parallel?
5) Are sharp corners (90°C or less than 90°C) avoided in the wire pattern?

印刷電路板


PCB設計 project check list
1. Check the rationality and correctness of the schematic diagram;
2. Check the correctness of the component package of the schematic diagram;
3. The distance between strong and weak current and the distance between isolated areas;
4. 原理圖的相應檢查和 PCB圖 to prevent the loss of the network table;
5. Whether the package of the component is consistent with the actual product;
6. Is the placement of the components appropriate:
A. Whether the components are easy to install and disassemble;
B. Whether the temperature sensitive element is too close to the heating element;
C. Whether the distance and direction of the components that can generate mutual inductance are appropriate;
D. Whether the placement between the connectors is smooth;
E. Easy to plug and unplug;
F. Input and output;
G. Strong current and weak current;
H. Whether digital and analog are interlaced;
I. Arrangement of elements on the upwind side and downwind side;
7. Whether the directional component has been wrongly flipped instead of rotated;
8. Whether the mounting holes of the component pins are suitable and whether it is easy to insert;
9. Check whether the empty pin of each component is normal and whether it is a missing line;
10. 檢查同一網臺上下層是否有通孔, and the pads are connected through the holes to prevent disconnection and ensure the integrity of the circuit;
11. 檢查上下層文字擺放是否正確合理, 不要放置組件來覆蓋字元, so as to facilitate the operation of welding or maintenance personnel;
12. 非常重要的上層和下層線路的連接不應僅與串聯元件的焊盤連接, it is best to use vias to connect;
13. The arrangement of power and signal wires in the socket should ensure signal integrity and anti-interference;
14. Pay attention to the proper ratio of pads and solder holes;
15. 插頭應放在 PCB板 as much as possible and easy to operate;
16. 檢查組件標籤是否與組件匹配, and the components should be placed in the same direction as possible and placed neatly;
17. 不違反設計規則, the power and ground wires should be as thick as possible;
18. 在正常情况下, 水平線用於上層,垂直線用於下層, and the chamfer is not less than 90 degrees;
19. PCB上安裝孔的尺寸和分佈是否合適, and minimize the bending stress of the PCB;
20. 注意PCB上元件的高低分佈以及PCB的形狀和尺寸,以確保易於組裝;