PCB新聞 - 多層PCB阻焊工藝中常見電路板品質問題及改進措施

多層PCB阻焊工藝中常見電路板品質問題及改進措施

在 多層PCB 焊接掩模工藝, 您在生產過程中可能會遇到各種問題 電路板, the common ones are as follows:

Problem: White spots in printing

Reason 1: The 印刷多層PCB has white spots

Improvement measures: the thinner does not match, use the matched thinner [please use the company's supporting thinner]

Reason 2: The circuit board is dissolved in the sealing tape

Improvement measures: use white paper to seal the net

problem: sticky film

Reason 1: The circuit board ink is not dried

Improvement measures: check the degree of ink drying

Reason 2: 多層PCB vacuum is too strong

Improvement measures: check the vacuum system (the air guide strip may not be added)

Problem: Poor exposure

Reason 1: Poor vacuum

Improvement measures: check the vacuum system

Reason 2: 多層PCB exposure energy is inappropriate

Improvement measures: adjust the appropriate exposure energy

Reason 3: The temperature of the 多層PCB exposure machine is too high

Improvement measures: check the temperature of the exposure machine (below 26)

Problem: The ink does not dry out

Reason 1: The exhaust air of the circuit board oven is not good

Improvement measures: check the exhaust air condition of the oven

Reason 2: Less thinner

Improvement measures: increase thinner, fully dilute

Reason 3: The ink is too thick

Improvement measures: appropriately adjust the ink thickness

Reason 4: The thinner dries too slowly

Improvement measures: use matching thinner [please use company supporting thinner]

Reason 5: The oven temperature is not enough

Improvement measures: Determine whether the actual temperature of the oven reaches the required temperature of the product

Problem: The development is not clean

Reason 1: It takes too long after printing

Improvement measures: control the storage time within 24 hours

Reason 2: The ink runs out before development

Improvement measures: work in the darkroom before developing (the fluorescent lamp is wrapped in yellow paper)

Reason 3: Development time is too short

Improvement measures: extend the development time

Reason 4: Exposure energy is too high

Improvement measures: Adjust exposure energy

Reason 5: Multi-layer circuit board ink is over-baked

Improvement measures: adjust the baking parameters, not to burn to death

Reason 6: Ink mixing is uneven

Improvement measures: Stir the ink evenly before the printed circuit board

Reason 7: Not enough developing potion

Improvement measures: the temperature is not enough to check the concentration and temperature of the medicine

Reason 8: The thinner does not match

Improvement measures: use matching thinner [please use company supporting thinner]

Problem: Excessive development (corrosion test)

Reason 1: The concentration of the potion is too high and the temperature is too high

Improvement measures: reduce the concentration and temperature of the potion

Reason 2: Development time is too long

Improvement measures: shorten the development time

Reason 3: Insufficient exposure energy

Improvement measures: Increase exposure energy

Reason 4: The developing water pressure is too large

Improvement measures: lower the developing water pressure

Reason 5: Ink mixing is uneven

Improvement measures: Stir the ink evenly before printing

Reason 6: The ink is not dried

Improvement measures: Adjust the baking parameters, see the question [Ink does not dry]

Problem: Green Oil Bridge Broken Bridge

Reason 1: Insufficient exposure energy

Improvement measures: Increase exposure energy

Reason 2: The sheet is not handled properly

Improvement measures: check the treatment process

Reason 3: Too much pressure for developing and washing

Improvement measures: check the developing and washing pressure

Problem: Foaming on the tin

Reason 1: Excessive development

Improvement measures: improve the development parameters, see the problem [over development]

Reason 2: The pre-treatment of the board is not good, 而且表面油膩多塵.

改進措施：做好預處理 多層PCB boards to keep the surface clean

Reason 3: Insufficient exposure energy

Improvement measures: check the exposure energy and meet the ink usage requirements

Reason 4: Abnormal flux

Improvement measures: adjust flux

Reason 5: Insufficient post-bake

Improvement measures: Baking process after inspection

Problem: Poor upper tin

Reason 1: The development is not clean

Improvement measures: improve several factors of poor image development

Reason 2: Post-baking solvent contamination

Improvement measures: increase oven exhaust or machine cleaning before spraying tin

problem: post-baking and exploding oil

Reason 1: There is no segmented baking

Improvement measures: stage baking

Reason 2: Insufficient viscosity of 多層PCB plug hole ink

Improvement measures: adjust plug hole ink viscosity

Problem: Ink matte

Reason 1: The thinner does not match

Improvement measures: use matching thinner [please use company supporting thinner]

Reason 2: Low exposure energy

Improvement measures: Increase exposure energy

Reason 3: Overdeveloped circuit board

Improvement measures: improve the development parameters, see the problem [over development]

Problem: Ink discoloration

Reason 1: Insufficient ink thickness

Improvement measures: increase ink thickness

Reason 2: Multilayer circuit board substrate oxidation

Improvement measures: check the pre-treatment process

Reason 3: The post-baking temperature is too high

Improvement measures: the time is too long to check the baking parameters

Problem: Ink adhesion is not strong

Reason 1: Ink type selection is inappropriate.

改進措施：更換合適的油墨.

原因2：墨水類型選擇不當.

改進措施：更換合適的油墨.

原因3：乾燥時間, 溫度不正確, 乾燥時排氣量太小.

改進措施：使用正確的溫度和時間, 並新增排氣量.

原因4：添加劑的用量不適當或不正確.

改進措施：調整用量或改用其他添加劑.

原因5：濕度過高.

改進措施：改善空氣乾燥度.

Problem: Blocking the Internet

Reason 1: Drying is too fast.

改進措施：添加緩幹劑.

原因2：列印速度太慢.

改進措施：提高速度，減緩乾燥劑.

原因3：多層PCB油墨粘度過高.

改進措施：添加油墨潤滑劑或超慢乾燥劑.

原因4：稀釋劑不合適.

改進措施：使用指定稀釋劑.

問題：穿透, blur

Reason 1: The ink viscosity is too low.

改進措施：提高濃度，不加稀釋劑.

原因2：電路板絲網壓力過大.

改進措施：減輕壓力.

原因3：刮刀不好.

改進措施：更換或改變刮網角度.

原因4：荧幕與列印表面之間的距離過大或過小.

改進措施：調整間距.

理由五：絲網張力變小.

改進措施：重新製作新的荧幕版本.

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