PCB新聞 - 印製電路板電鍍槽尺寸的計算方法

尺寸之間的關係 PCB打樣 電鍍槽和平均負載能力, 陰極電流密度, 體積電流密度, 等.；

PCB打樣 一般來說, 電鍍槽的尺寸是指電鍍槽中電解液的體積L, 也稱為有效體積, 那就是, 電鍍槽內腔的長度X內腔的寬度X電解液的深度；

PCB打樣 一般可根據電鍍加工量或現有直流電鍍設備等條件進行計算和匹配；

選擇合適的電鍍槽尺寸，對製定生產計畫、估算生產能力、保證電鍍質量具有重要意義；

確定電鍍槽尺寸的3個考慮因素：

1. Meet the size requirements of processed parts;
2. Prevent the electrolyte from overheating;
3. A.ble to maintain a certain stability of electrolyte components during the electroplating production cycle;

The current density of the cathode 和 anode is calculated based on the total area actually immersed in the electrolyte. There is a slight difference due to the difference in the current efficiency of the cathode and anode;
DA=I total/S Yin (A/dm2)
DA=I total/S Yang (A/dm2)
Average loading d: the volume of electrolyte needed for electroplating parts per unit area
is d=V/S(L/ dm2)
Volume current density DV:
The current intensity per unit volume is: DV=Itotal/V(A/L)

PCB打樣 電鍍過程中適當控制體積電流密度很重要, 因為通過電解液的電流會因溶液的電阻而產生熱量, 導致電解溫度升高, 電解質加熱的速度和水准與體積電流密度直接相關. 為了防止電解液加熱過快, 需要較大體積的電解液以降低體積電流密度；

如酸性光亮鍍銅工藝：合適的體積電流密度為0.3-0.4A/L，即當總電流為1000A時，應配備2500-3000L電解液；

經驗數據：

PCB打樣 The following data is some empirical data related to the cathode current density and average loading of various common plating species:
Plating species Cathode current density range DK, A/ dm2平均負載d, L/ dm2
Sulphate copper plating 1.0---3.0 7---9
Acid tin plating 1.0---3.0 7---9
Bright nickel 2.0---4.0 6---8
Nickel 1.0---1.5 6---8

The above is an introduction to the calculation method of the size of the circuit board electroplating tank for PCB打樣. Ipcb也提供給 PCB製造商 and PCB製造 科技