佈局和佈線的基本規則 PCB板 components
Basic rules of component layout
1 根據電路模塊進行佈局, 實現相同功能的相關電路稱為模塊. 電路模塊中的元件應採用就近集中的原則, and the digital circuit and the analog circuit should be separated;
2. 任何組件或裝置不得安裝在1.27mm非安裝孔,如定位孔, 標準孔, 和3.5mm (for M2.5) and 4mm (for M3) of 3.5mm (for M2.5) and 4mm (for M3) shall not be mounted on components;
3. 避免在水准安裝的電阻器下方放置通孔, inductors (plug-ins), electrolytic capacitors and other components to avoid short-circuiting the vias and the component shell after wave soldering;
4. The distance between the outside of the component and the edge of the board is 5mm;
5. The distance between the outside of the mounting component pad and the outside of the adjacent interposing component is greater than 2mm;
6. Metal shell components and metal parts (shielding boxes, 等.) can not touch other components, 不能靠近列印線, 墊, 其間距應大於2mm. 定位孔尺寸, 緊固件安裝孔, oval holes and other square holes in the board from the outside of the board edge is greater than 3mm;
7. Heating elements should not be in close proximity to wires and heat-sensitive elements; high-heating elements should be evenly distributed;
8. 電源插座應盡可能佈置在印製板周圍, 電源插座和與其相連的母線端子應佈置在同一側. 應特別注意不要在連接器之間佈置電源插座和其他焊接連接器,以便於這些插座和連接器的焊接, 以及電力電纜的設計和捆紮. The arrangement spacing of power sockets and welding connectors should be considered to facilitate the plugging and unplugging of power plugs;
9. Arrangement of other components:
All IC components are aligned on one side, 極性分量的極性標記清楚. 同一印製板的極性標記不能超過兩個方向. 出現兩個方向時, the two directions are perpendicular to each other;
10. 板面佈線應密實. 密度差過大時, 應填充網眼銅箔, and the grid should be greater than 8mil (or 0.2mm);
11. SMD焊盤上不應有通孔,以避免焊膏流失,並導致組件虛焊. Important signal lines are not allowed to pass between the socket pins;
12. 面片在一側對齊, 字元方向相同, and the packaging direction is the same;
13. 盡可能地, 極化器件應與同一板上的極性標記方向一致.
二、元件接線規則
1. 在距離 PCB板 安裝孔周圍1mm範圍內, wiring is forbidden;
2. The power line should be as wide as possible and should not be less than 18mil; the signal line width should not be less than 12mil; the cpu input and output lines should not be less than 10mil (or 8mil); the line spacing should not be less than 10mil;
3. The normal via is not less than 30mil;
4. 雙列直插式:60mil焊盤, 40mil aperture;
1/4W resistance: 51*55mil (0805 surface mount); when in-line, the pad is 62mil and the aperture is 42mil;
Infinite capacitance: 51*55mil (0805 surface mount); when in-line, pad為50mil, and the aperture is 28mil;
5. 請注意,電源線和地線應盡可能呈徑向, 訊號線不應迴圈.