PCB科技 - 相關PCB科技研究

相關的 印刷電路板科技 research
Process method
For some areas where the device is mounted on both sides, 容易引起局部高溫. 為了改善散熱條件, 錫膏中可混入少量銅, 再流焊後，設備下方的焊點會有一定的高度. 設備和 印刷電路板 新增了, 對流散熱新增.
33 Requirements for the arrangement of components
(1) Perform software thermal analysis on 印刷電路板, and design and control the internal maximum temperature rise;
(2) It is possible to consider specially designing and installing components with high heat generation and large radiation on a printed 電路板;
(3) The heat capacity of the board is evenly distributed. 注意不要集中放置大功率設備. 如果不可避免, place the short components upstream of the airflow and ensure that sufficient cooling air flows through the heat-consumption concentrated area;
(4.) Make the heat transfer path as short as possible;
(5) Make the heat transfer cross section as large as possible;
(6) The layout of components should take into account the influence of heat radiation on surrounding parts. Heat sensitive parts and components (including semiconductor devices) should be kept away from heat sources or isolated;
(7) (Liquid medium) It is best to keep the capacitor away from the heat source;
(8) Pay attention to the direction of forced ventilation and natural ventilation;
(9) The additional sub-boards and device air ducts are consistent with the ventilation direction;
(10) Make the intake and exhaust as far away as possible;
(11) The heating element should be placed above the product as much as possible, and should be placed on the air flow channel when conditions permit;
(12) Components with high heat or high current should not be placed on the corners and peripheral edges of the 印刷電路板. 如果可能的話, 它們應安裝在散熱器上, 遠離其他部件, and ensure that the heat dissipation channel is unobstructed;
(13) (Small signal amplifier peripheral devices) Try to use devices with small temperature drift;
(14) Use metal chassis or chassis as much as possible to dissipate heat

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3.4 Requirements for wiring
(1) Board selection (reasonable design of 印刷電路板 structure);
(2) Wiring rules;
(3) Plan the minimum channel width according to the current density of the device; pay special attention to the channel wiring at the junction;
(4) The high-current lines should be as surface as possible; if the requirements cannot be met, the use of bus bars can be considered;
(5) Minimize the thermal resistance of the contact surface. 出於這個原因, 應擴大導熱面積； 接觸面應平整光滑, 如有必要，可進行噴漆.
Coated with thermal grease;
(6) Consider the stress balance measures for thermal stress points and thicken the lines;
(7) The heat-dissipating copper skin needs to adopt the window method of heat dissipation stress, and use the heat-dissipating solder mask to open the window properly;
(8) If possible, use large-area copper foil on the surface;
(9) Use larger pads for the ground mounting holes on the 印刷電路板 充分利用安裝螺栓和 印刷電路板 for heat dissipation;
(10) Place as many metalized vias as possible, 孔徑和盤面應盡可能大, relying on vias to help heat dissipation;
(11) Supplementary means for device heat dissipation;
(12) In the case where the large surface area of copper foil can be used, the method of adding a heat sink may not be used for economic reasons;
(13) Calculate the appropriate surface heat dissipation copper foil area according to the power consumption of the device, the ambient temperature and the maximum allowable junction temperature (guarantee principle tjâ ¤(0.50.8)tjmax).
4. Thermal simulation (thermal analysis)
Thermal analysis can help designers determine the electrical performance of components on the 印刷電路板， 並幫助設計師確定組件或 印刷電路板s會因高溫而燒毀. 簡單熱分析僅計算 印刷電路板, 而複雜的電子設備需要建立包含多個 印刷電路板和數千個組件.