PCBA科技 - pcba加工單面和雙面smt貼片工藝是什麼

什麼是 電路板裝配.加工 single and double sided smt 色斑 processes
1. Single-sided assembly:
Incoming 視察 => silk screen solder paste (point 色斑 glue) => 色斑 => 乾燥 (curing) => 回流焊 => 打掃 => inspection => repair

2. Double-sided assembly:
A：進貨檢驗 => 印刷電路板's A-side silk-screen solder paste (point SMD glue) => SMD 印刷電路板's B-side silk screen solder paste (point SMD glue) => SMD => Drying => Reflow soldering ( It is best to only apply to side B => 打掃 => inspection => repair).

B：進貨檢驗 => 印刷電路板's A side silk screen solder paste (point 色斑 glue) => SMD => Drying (curing) => A側回流焊 => Cleaning => Turnover = 印刷電路板's B side point Patch glue => patch => curing => B surface wave soldering => 打掃 => inspection => repair)
This process is suitable for reflow soldering on the A side of the 印刷電路板 B側波峰焊. 在裝配在 印刷電路板, this process should be used when there are only SOT or SOIC (28) pins or less.

3、單面混合包裝工藝：

進貨檢驗=>印刷電路板 A面絲網焊膏（點貼片膠）=>SMD=>乾燥（固化）=>回流焊=>清潔=>挿件=>波峰焊=>清潔=>檢查=>返工

4、雙面混合包裝工藝：

A: Incoming inspection => 印刷電路板's B side point patch glue => SMD => curing => flipping => 印刷電路板's A side plug-in => wave soldering => 打掃 => inspection => rework, 先粘貼, 然後插入, 它適用於SMD組件比單獨組件多的情况.
B: Incoming inspection => 印刷電路板's A side plug-in (pin bend) => flip board => 印刷電路板's B side patch glue => patch => curing => flip board => wave soldering => cleaning => Inspection => Rework, 首先插入, 然後粘貼, 適用於獨立組件比SMD組件多的情况.

C：進貨檢驗=>印刷電路板 A側絲網焊膏=>貼片=>乾燥=>回流焊=>挿件、引脚彎曲=>周轉=>印刷電路板側B點貼片膠=>貼片=>固化=>翻轉=>波峰焊=>清潔=>檢驗=>返工A側混合裝配、B側安裝。

D：進貨檢查=>印刷電路板 B側點貼片膠=>貼片=>固化=>翻轉板=>印刷電路板 A側絲網焊膏=>貼片=>A側回流焊=>挿件=>B側波峰焊=>清潔=>檢查=>返工A側和B側混合安裝。首先在SMD兩側粘貼，回流焊，然後插入， 波峰焊E：進貨檢驗=>印刷電路板的B面絲網焊膏（點貼膠）=>SMD=>乾燥（固化）=>回流焊=>翻轉板=>印刷電路板的A面絲網焊膏=>SMD=>乾燥=回流焊1（可以使用部分焊接）=>挿件=>波峰焊2（如果組件較少，可以使用手動焊接）=>清潔=>檢驗=>返工 A側安裝和B側混合安裝。

五、雙面組裝工藝

A：來料檢驗，印刷電路板 A側絲網焊膏（點貼膠）、貼片、烘乾（固化）、A側回流焊、清洗、翻轉； 印刷電路板 B側絲網焊膏（點貼片膠）、貼片、乾燥、回流焊（最好僅適用於B側、清潔、測試和返工）當PLCC等大型SMD連接到印刷電路板兩側時，此過程適用於拾取。

B: Incoming inspection, 印刷電路板 A side silk screen solder paste (dot patch adhesive), patch, drying (curing), A側回流焊, cleaning, 翻轉； 印刷電路板 B側點修補膠, patch, 固化, B面波峰焊, cleaning, inspection, rework) This process is suitable for reflow on the A-side of the PCBA.