PCB科技 - PCB生產工藝的完整版本

印刷電路板生產工藝的完整版本

今天為您帶來了 印刷電路板 生產工藝流程, 我希望你能對 印刷電路板 生產!

印刷電路板--Cut Lamination

Objective: according to the requirements of the engineering data M我, the large sheet meeting the requirements is cut into small pieces of production sheet and small pieces to meet the requirements of customers

過程: large board cutting according to MI requirements

印刷電路板--Drill hole

Objective: according to the engineering data, drill the required hole diameter at the corresponding position on the plate with the required size

Process: lamination - put on board - drilling - put off board - inspection / 修理

印刷電路板--PTH

Objective: to deposit a thin layer of copper on the wall of insulating hole by chemical method

Process: rough grinding - hanging plate - automatic copper sinking line - lower plate - dilute H2SO4 - increase copper

印刷電路板--Dry film

Objective: graphic transfer is to transfer the image on the production 向董事會貼膜

Process: (solder mask process): board grinding - printing the first side - drying - printing the second side - drying - exposure - developing - inspection Dry film process: pressing film - standing - alignment - exposure - standing - developing - inspection

印刷電路板--Etching

Objective: etching is to use chemical reaction method to remove the copper layer of non circuit parts

印刷電路板--Solder mask

Objective: solder mask is to transfer the graphics of green ink, film to the board, so as to protect the circuit and prevent the tin on the circuit when welding parts

Process: grinding plate - printing photosensitive green oil - curium plate - exposure - development; board grinding - printing the first side - drying plate - printing the second side - drying plate

印刷電路板--Silk screen

Objective: silk screen is a kind of mark which is easy to identify

Process: solder mask after final curium - cooling and standing - screen adjustment - character printing - back curium

印刷電路板--Surface treament

Objective: to coat a nickel / 塞指上具有所需厚度的金層, so as to make it have more hardness and wear resistance

Process: grinding board - degreasing - twice water washing - micro erosion - twice water washing - pickling - copper plating - water washing - nickel board - washing - gold plating

印刷電路板--Outline

Objective: through the mold stamping or CNC 鑼 machine gongs out of the customer needs the shape forming method, 有機鑼, 啤酒委員會, gongs, hand cut

Note: the accuracy of data gong machine board and beer board is higher than that of hand Gong, 手工砧板只能做出一些簡單的形狀

印刷電路板--Test

Objective: to detect the open circuit, short circuit and other defects that are difficult to find by visual inspection

Process: mold loading - board setting - test - qualified - FQC visual inspection - unqualified - repair - return to test - OK - reject - scrap

印刷電路板--Final inspection

Objective: through 100% visual inspection of plate appearance defects, 並修復小缺陷, to avoid problems and defective plate outflow

Specific work process: incoming 材料 - check data - visual inspection - qualified - FQA spot check - qualified - packaging - unqualified - treatment - check -OK

So, 以上是關於 印刷電路板, 如果你有其他建議, iPCB 歡迎與您交流.

電路板工藝流程