PCB科技 - PCB生產科技

銅沉積和板電

1. 設施：desmear, PTH和聚丙烯自動生產線.

2.、用途：本工藝是在內層壓鑽孔後，在鑽孔板孔內沉積一層密度高、細密透徹的薄層銅層，然後通過整板電鍍法獲得一層0.2～0.6mil厚的通孔導電銅（簡稱初銅）。

外部幹膜

A layer of gelatin (dry film) is pasted on the surface of the copper foil on the surface of the 印刷電路板, 然後通過黃色薄膜暴露到相反的位置, 開發後形成電路圖.

Roller plate:
1. 設施：半自動貼膜機, semi-automatic dust machine;
2. Utility: paste a layer of gelatin (dry film) on the surface of copper plate;
3. 影響貼膜效果的主要因素：溫度, pressure and speed of hot roller;
4. Lack of film initiation: short circuit (film wrinkle), open circuit (film foam, garbage);
5. 用於發泡, 起皺, 垃圾和其他木板需要翻過來清洗.

Manufacture of huangfeilin:
1. 方法：使用黑色膠片作為母膜, 暴露後, 將黑色膠片上的圖像轉換為黃色膠片.
2. Utility:
a. The effect of exposure is to transfer the image on black film to yellow film through exposure;
b. 氨顯色劑是通過氨顯色劑暴露黃色薄膜, so that it becomes clear and clear pattern;
c. 保養好膜的效果是在黃飛林的膜面上粘一層聚乙酯, and try to take care of the film to avoid scratching;
3. 設施 / 工具：曝光機, 合成氨機, 用於維護機器的滾輪, 10倍鏡像.

Exposure:
1. 設施 / 工具：曝光機, 10倍鏡子, 21步曝光尺, manual dust machine;
2. 曝光機, 黑色膠片或黃色膠片對位拍板後, 曝光, and transfer the pattern on it to the board surface;
3. The main factors that affect the exposure: exposure energy + trace (commonly measured with 21step exposure ruler) and vacuum degree;
4. Defects easy to sprout: open circuit (bad exposure to light), short circuit (exposure to garbage), 鑽孔塌陷.

Development:
1. Facilities: developing machine (punching machine);
2. 用途：用Na2CO3溶解未暴露資料後, 裸露的銅表面形成電路, 外露部分形成線隙, which is used for the next electroplating process;
3. Process flow:

4. The main developing drug: Na2CO3 solution;
5. The main factors that affect the development are as follows
a. The concentration of Na2CO3 in developing solution was determined;
b. Temperature;
c. Pressure;
d. Developing point;
e. 速度.
6. The main defects that are easy to sprout are: open circuit (broken film, endless punching plate), short circuit (over punching plate), residual copper in hole (penetrating film).

Retention leakage
Effectiveness: check the developed 印刷電路板 董事會, 撕下貼膜並翻轉無法修復的缺陷, 並修復可以修復的缺陷.

Clean room background requirements:
Temperature: 20 ± 3 degree Celsius;
Relative humidity: 55 ± 5%;
Dust content: dust particles above 0.5萬立方米 / L.f.

Rules for safety:
1. 向研磨機和衝床添加藥液時，務必戴上耐酸堿手套, and wear a mask for protecting the face when protecting and recuperating;
2. 在軋鋼機正常運行期間, it is forbidden to put the head and hand into the film pressing area and touch the hot roller with hands;
3. 嚴禁在光照下打開機器蓋, 防止紫外線對人體的輻射.

Environmental protection projects:
1. 中厚板廠和中厚板衝床的廢水和廢液應在每班下班前半小時通過非分心筦道排入廢水站進行處理.
2. 剩餘資料, 廢紙箱, 廢紙皮, 生產部門應盡可能多地處理廢棄GII和薄膜，並將其放在垃圾箱中，由清潔工收集.
4. 空硫酸桶, 鹽酸桶, 消泡劑瓶, 薄膜桶和片狀堿袋由生產部按mei051進行處理並返回倉庫.

圖案 印刷電路板 plating
Introduction and utility:
1. 設施圖形電鍍生產線.
2. 實用圖案電鍍是鑽井室PTH後的一個封閉過程 / PP-D / F. D之後 / F負責洩漏, 孔內、線外電鍍，滿足鍍銅厚度要求.

Process flow and utility:

1. Flow chart
Upper plate - acid degreasing - secondary water washing - micro 等hing - water washing - acid leaching - copper plating - water washing - acid leaching - tin plating - secondary water washing - baking - lower plate - frying rod - secondary water washing - upper plate

2. 實用程式和參數, items for attention:
a. 脫脂：去除板表面的氧氣層和表面污染物.
溫度：40攝氏度±5攝氏度.
Main ingredients: detergent (acid), 去離子水.
b. 微蝕刻：啟動板面，增强Pt之間的結合力 / PP.
溫度：30攝氏度 45攝氏度.
主要成分：過硫酸鈉, 硫酸, 去離子水.
c. 酸浸：去除預處理和銅筒中的污染物.
主要成分：硫酸, 去離子水.
d. 鍍銅：為了使孔和電路中的銅層變厚, 提高塗層質量，滿足客戶要求.
溫度：21攝氏度ë½攝氏度32攝氏度.
主要成分：硫酸銅, 硫酸, 發光劑, 等.
易萌缺：薄銅, 大洞，大洞, 小孔, 電影剪輯, 電路不良, 等.
e. 鍍錫：為了更好地保護電路和方便地蝕刻電路板, 只有一半的腰部應該抬高，以照顧效用.
溫度：25攝氏度±5攝氏度.
主要成分：硫酸亞錫, 硫酸, 拋光劑, 去離子水, 等.
治療時間：8-10分鐘.
容易發芽和缺乏：錫薄, 斷線，斷線, 剪輯膠片, etc.

3. Attention items
Check whether the liquid level, 煽動, 溫度, 搖晃, 冷卻系統和循環系統運行良好.

Safety and environmental protection precautions:
1. 確保通風系統在此過程中符合要求, 並佩戴防腐橡膠手套, 防護面罩, 護目鏡及其他相關安全勞保用品.
2. 排放時應按分類處理廢渣和廢液, 經環境保護部門許可.