PCB科技 - PCB清洗工藝詳細說明

印刷電路板(PCB) needs to be cleaned many times. 然後, 哪些連結需要清洗以及如何清洗? 下一個, 電工之家總結的清潔過程總結供您參攷.

1. 切割：將大板切割成所需的小塊.
   洗板：清潔並風乾板上的灰塵和雜質 印刷電路板機器.

   
   

2. 內幹膜：在銅箔上粘貼一層明膠, 然後對黑色膠片進行反向曝光和顯影，形成電路圖.
   Chemical cleaning:
   (1) Remove the oxygen compounds and garbage on the 表面 of Cu; slander the surface of Cu to strengthen the bonding force between the surface of Cu and gelatin.
   (2) Process: degreasing - water washing - micro erosion - high pressure water washing - circulating water washing - water absorption - strong wind drying - hot air drying.
   (3) The influencing factors of plate washing are: degreasing speed, 脫脂劑液體濃度, 微腐蝕溫度, 總酸度, Cu2 + liquid concentration, 壓力和速度.
   (4) Easy to sprout and lack: open circuit - cleaning effect is very poor, 導致影片被拒； 短路-清潔不是清潔發芽廢物.

   
   

3. 銅沉積與板電

   
   

4. 外部幹膜

印刷電路板(PCB)

5. 圖形電鍍：在孔和電路中實施，以滿足鍍銅厚度的要求.
(1) Degreasing: removing oxygen layer and surface pollutants on the board surface;
(2) Acid leaching: removal of pollutants from pre-treatment and copper cylinder;

6. 印刷電路板electrogold:
(1) Degreasing: remove grease and oxygenates on the surface of circuit diagram to keep copper surface clean.

7. Wet green oil:
(1) Pre treatment: remove the oxygen film on the surface and roughen the surface to strengthen the bonding force between green oil and 印刷電路板 surface.

8 Tin spraying process:
(1) Hot water washing: cleaning the surface of circuit board dirt and local ions;
(2) Scrubbing: further cleaning the residual debris left on the circuit board surface.

9. Gold deposition process:
(1) Acid degreasing: remove mild grease and oxygenates on the surface of copper, 以啟動和清潔表面, 形成適合鍍鎳、鍍金的外觀.

10. Shape processing
(1) Plate washing: remove surface pollutants and dust. 11. Netek銅表面處理.
(2) Degreasing: remove grease and oxygenates on the surface of circuit diagram to keep copper surface clean.

銅表面精整的步驟如下：

1、幹膜壓制

2、內層充氧前

3、鑽孔後（清除殘留膠，清理鑽孔過程中萌生的膠體體，使其變粗、變乾淨）（機械研磨板：用振動波將孔清理幹淨，振動波可產生超强的聽力，並將孔內的銅粉和膠粒徹底清理乾淨）

4、化學鍍銅前

5、鍍銅前

6、綠漆前

7、噴錫前（或其他焊墊處理工藝）

8. 金手指鍍鎳前

二次銅的預處理：

脫脂-水洗-微蝕刻-水洗-酸浸-鍍銅-水洗。 去除了在先前的外部電路製造過程中可能留在電路板表面的所有雜質，如氧化、指紋和微小物體。 並具有表面活性，使鍍銅附著力良好。

裝運前，應進行清潔，並清除離子污染。