PCB部落格 - PCB板光繪（CAM）的操作過程

關於操作流程 PCB電路板 light painting:
1. Check the user's files
The files brought by the user must first be checked routinely:
1) Check whether the disk file is intact;
2.) Check whether the file has an asterisk, 如果有星號, you must kill the asterisk first;
3) If it is a Gerber file, 檢查內部是否有D代碼表或D程式碼.

2. Check whether the design conforms to the technical level of our factory
1) Check whether the various spacings designed in the customer's documents conform to the factory's process: the spacing between lines and lines, 線和焊盤之間的間距, 以及焊盤和焊盤之間的間距. 上述各種間距應大於工廠生產過程中可以實現的間距.
2) Check the width of the wire, 要求金屬絲的寬度應大於我廠生產工藝所能達到的線寬.
3) Check the size of the via hole to ensure the aperture of the factory's production process.
4) Check the size of the pad and its internal aperture to ensure that the edge of the pad after drilling has a certain width.

3. Determine the process requirements
Various process parameters are determined according to user requirements. Process requirements:
3.1根據後續流程的不同要求, determine whether the light-painted 消極的 (commonly known as film) is a mirror image. 膠片鏡像原理：將膠片粘貼在膠片表面以减少誤差. 底片鏡像的决定因素：過程, 如果是絲網印刷工藝或幹膜工藝, 應以負膜的膜表面和基板的銅表面為准. 如果用重氮膠片曝光, 因為重氮膠片在複印過程中是鏡像的, 鏡像應該是負片的膜表面沒有附著到基板的銅表面. 如果照相是作為一個單元底片而不是施加在照相底片上，則需要額外的鏡像.
3.2確定阻焊板膨脹參數.
Determination principles: 1) Do not expose the wires next to the pads. 2) Small can not cover the pad. 由於操作錯誤, 焊接掩模圖可能偏離電路. 如果阻焊膜太小, 偏差的結果可能會掩蓋焊盤邊緣. 因此, 要求阻焊板更大. 然而, 如果阻焊膜膨脹過大, 由於偏差的影響，相鄰導線可能會外露.

根據上述要求, it can be seen that the determinants of solder mask expansion are:
1) The deviation value of the solder mask process position of our factory and the deviation value of the solder mask pattern. 由於各種工藝引起的不同偏差, 對應於各種工藝的阻焊膜膨脹值也不同. 偏差較大的阻焊板膨脹值應選擇較大值.
2) If the wire density of the board is high, 襯墊和導線之間的距離很小, 且阻焊膜的膨脹值應較小； 如果電路板的導線密度較小, 阻焊板的膨脹值應更大.
3) According to whether there are printed plugs (commonly known as gold fingers) on the board to determine whether to add process lines.
4) Determine whether to add a conductive frame for electroplating according to the requirements of the electroplating process.
5) According to the requirements of the hot air leveling (commonly known as tin spraying) process, 確定是否添加導電工藝線.
6) Determine whether to add the center hole of the pad according to the drilling process.
7) Determine whether to add process positioning holes according to the subsequent process.
8) According to the shape of the board, 確定是否添加形狀角度.
9) When the user's high-precision board requires high line width accuracy, 有必要根據我廠的生產水准確定是否進行線寬校正，以調整側面侵蝕的影響.

4. Convert CAD files to Gerber files
In order to carry out unified management in the CAM process, 所有CAD檔案應轉換為光繪圖器的Gerber標準格式和等效的D代碼表. 在轉換過程中, 應注意所需的工藝參數, 因為在轉換過程中需要完成一些要求. 在當前通用CAD軟件中, 除了Smart Work和Tango軟件, 可以轉換為Gerber, 上述兩種軟件也可以通過工具軟體轉換為Protel格式, 然後改成格伯.

5. CAM processing
Various process treatments are carried out according to the specified process.
Special attention should be paid to whether there are any places in the user file that are too small and must be dealt with accordingly

6. Light drawing output
The files processed by CAM can be output by light drawing. 施加工作可以在CAM中或在輸出時進行. 一個好的繪圖器系統具有一定的CAM功能, 並且必須在光電繪圖器上進行一些處理, 例如線寬校正.

7. Darkroom processing
The light-painted negative film needs to be developed and fixed before it can be used in the subsequent process. 在暗室處理時, the following links should be strictly controlled: development time: affecting the optical density (commonly known as blackness) and contrast of the production master. 如果時間短, 光密度和對比度不够； 如果時間太長, 霧會新增. 固定時間：如果固定時間不够, 生產基地的背景色不够透明. 未清洗時間：如果清洗時間不够, 生產板很容易變黃. 特別注意的是不要刮傷漆膜 PCB板 negative.