PCB新聞 - PCB熱設計一般指南

通用指南 PCB熱設計 are as follows:

(1) During layout design, 組件之間以及組件和晶片之間應盡可能保留空間，以便於通風和散熱.
(2) Keep components with low temperature specifications away from components with high temperature specifications. E.g:
CPU:100 degree Celsius HDD:60 degree Celsius
N/B:105攝氏度FDD磁片：51.5 degree Celsius
S/B:85 degree Celsius CDROM:60 degree Celsius
VGA:85 degree Celsius PCMCIA CARD:65 degree Celsius
C/G:85 degree Celsius Other ICs:70 degree Celsius
(3) For ICs 和 components estimated to have heat dissipation problems, 應留有足够的空間放置改進方案. 例如：不要在集成電路周圍有任何更高的零件，以便於放置金屬散熱器，以便將來散熱.
(4) Large components (such as CPU) and cooling modules should be as close as possible to the edge of the CPU to reduce thermal resistance.
(5) The medium (TIM, thermal interface 材料) between the heat dissipation module and the CPU has a great influence on the efficiency of the module. 應選擇熱阻低的資料, 甚至相變資料.
(6) The contact pressure between the group and the heat-dissipating component should be as large as possible within the specifications, 應確認兩個接觸面連接完好, 平坦且均勻.
(7) The body part of the heat dissipation module should not be too small, 儘量擴大與熱管的接觸面積, 這樣加熱晶片的熱量可以傳導到散熱模塊.

(8) The heat exchange fins in the Thermal module are enlarged in the direction perpendicular to the wind flow, 哪個方向比平行方向更有效.
(9) H/P在使用壓扁和彎曲時有其局限性, 應該注意哪些方面.
(10) The overall flow path design should avoid backflow to reduce wind resistance and noise.
(11) The gap between the outlet of the Module and the outlet of the N/B應具有封閉的流道，以防止熱空氣流回N/B.
(12) The heat dissipation and ventilation design has a large opening rate, 並將小圓孔或網格替換為大的細長孔，以减少風阻和譟音.
(13) Special attention should be paid to the shape and size of the air inlet of the fan, 以及舌片和漸開線的設計.
(14) There should be no obstruction within 3mm~5mm outside the air inlet of the fan.
(15) Chips with high calorific value should be placed on the motherboard as much as possible to avoid overheating of the bottom case; if it is necessary to place the chip under the motherboard, 晶片和底殼之間應留有空間，以充分利用空氣滲透, 氣流或散熱. 放置解決方案空間.

以上介紹了 PCB熱設計. Ipcb也提供給 PCB製造商 and PCB製造 科技.