PCB技術 - 無電解ニッケル‐金および電気めっきニッケル‐金およびPCB回路基板TiNの利点と欠点—利点と欠点

1. ケミカルニッケルゴールド(ENIG)
   Nickel gold is a relatively large surface treatment process. ニッケル層はニッケル−リン合金層である. リン内容によると, それは高リンニッケルと中りんニッケルに分けられる. アプリケーションが異なっている.
   
   The advantages of nickel-gold:
   Suitable for lead-free soldering-->The surface is very flat, suitable for SMT-->Through holes can also be coated with nickel and gold-->Long storage time, storage conditions are not harsh-->Suitable for electrical testing-->Suitable for switch contact design -->Suitable for aluminum wire binding, 厚板にふさわしい, 環境攻撃に対する強い抵抗.
   
   

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2. 電気めっきニッケル金

電気めっきされたニッケル金は、「ハード金」と「柔らかい金」に分けられます. Hard gold (such as goldcobalt alloy) is commonly used on gold fingers (contact connection design), ソフトゴールドは純金. ニッケルと金の電気めっきは広く使われている IC基板(（pbgaなど）). 主に金や銅線の接合に適している. しかし, IC基板のめっきは適している. ボンディングされた金フィンガー領域は、更なる伝導線で電気メッキされる必要がある.

The advantages of electroplating nickel gold:

Long storage time>12 months-->Suitable for contact switch design and gold wire binding-->Suitable for electrical test

Weaknesses of nickel-gold electroplating:

Higher cost, thicker gold-->Additional design wire conductivity is needed when electroplating gold fingers-->Because the thickness of gold is not constant, それは、あまりに厚い金のためにはんだ接合脆化を引き起こして、溶接に適用されるとき、強さに影響を及ぼすかもしれません.--> The problem of surface uniformity of electroplating-->The electroplated nickel and gold do not cover the edge of the wire-->It is not suitable for aluminum wire bonding. Not suitable --> High storage conditions are required.

の利点と欠点 PCB回路基板 tin spraying
Tin spraying was a common treatment in the early days of PCBs. 現在、それは鉛スプレー・スズと無鉛スプレー・ティンに分けられます.

The advantages of tin spraying:

Long storage time -->After the PCB is completed, the copper surface is completely wetted (the tin is completely covered before soldering)
Suitable for lead-free soldering-->Mature process-->Low cost-->Suitable for visual inspection and electrical measurement

Weaknesses of tin spraying:

-->Not suitable for wire bonding; due to surface flatness, there are limitations on SMT; not suitable for contact switch design --> Copper will dissolve when spraying tin, and the board will withstand a high temperature --> Especially thick or thin board, すず噴霧には限界がある, そして、製造操作は不便です.