PCBA技術 - PCBAプロジェクトの成功のための全プロセスの解析

Analysis of all プロセスes for the success of the PCBA project
1. Preliminary preparation stage
1. PCBAプロジェクト仕様, technical parameters and requirements;
2. プロジェクトの準備のためのリードグループ, プロセス設計責任, プロセス実装, プロジェクト報告, etc.;
2. Design and development
The standard of this link is the circuit design ability that can meet the SMT生産 process.
3. のための作業指示の設計と編集 SMT生産 process
1. 作業指示の形式を明確にする, これは PCBA処理 factory;
2. The content of the operation instruction is clear (the operation instruction for solder paste selection, ステンシル使用のための操作指示, パッチ処理操作命令, リフロー溶接プロセス制御命令, etc.);

4. Confirmation of steel mesh production capacity
1. The process of making steel mesh;
2. The patch processing factory exports Gerber files suitable for stencil production from PCB files to guide the process of stencil production;
5. Confirmation of the programming and operating capabilities of the placement machine
1. Evaluation of BOM list and Gerber documents;
2. 配置機械プログラミング, PCB size measurement and board assembly processing;
Six, PCBA assembly test
1. Test after smt patch processing and production (aging, 燃焼, シグナル, 高温・低温, ICTテスト, etc.);
2. 三塗料塗装, etc. (three-proof refers to which three-proof, please refer to our previous analysis of the problem);
Seven, PCBA patch project improvement and evaluation
1. PCBA設計 mutual inspection
2. Report
3. 改善提案