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IC Substrateboard product Technology
ICconstruction technology is an important part in the electronics industry. The main function of electronic construction is to protect, support, wire and manufacture heat dissipation, and provide a modular and specification standard for parts.
Traditional technology
BGA products were developed in the 1990s. Compared with traditional architectures, BGA architecture has advantages such as better heat dissipation and electrical properties, and the number of pins can be greatly increased. BGA packaging has derived different product types, such as CBGA (Ceramic BGA), PBGA(PlasticBGA), TBGA(Tape BGA) and so on. PBGA resin substrate, low price and good heat resistance, easy to become the IC substrate.
As the number of I/ OS increases and the spacing of integrated circuits decreases, it becomes difficult to efficiently arrange the wiring on THE BGA substrate. Flip Chip technology is the mainstream trend of future carrier development. The better the electrical characteristics are, the smaller the volume is, but the number of I/O ports is increasing. In the design of point 18 process (pattern width 0.18μm) or high speed (such as over 800MHz) IC, there is a trend to increase THE I/O density greatly. Flip Chip technology is one of the construction methods to solve this problem. It has high I/O and excellent electrical properties. After 2006, each IC Substrate factory competed for investment in the product project. In addition to CPU, GPU, And BQ chip in PC, the adoption rate of the downstream products has reached a certain level. In the future, the growth power of the crystal substrate will come from the NQ chip, high-frequency communication chip, and CPU/GPU chip packaging of game console in PC. In addition, in addition to the need for coating technology, the requirements of downstream product system integration will become more and more obvious, so the demand for MCM in multi-chip module process will also increase greatly. It is expected that MCM will become the growth potential products together with the coating carrier in the market, and the demand will increase year by year.
Chip Scale Packaging (CSP) technology can be divided into four categories: Lead Frame, Flexible Interposer, Rigid Interposer, Wafer Level Processed CSP and so on. Applied to memory products and high frequency low pin number of electronic products
Latest development technology
System in Package (SiP) is similar to the definition of multi-chip Module (MCM). SiP refers to the encapsulation of a component system, which can include a chip or RCL passive component, or even other modules, or a combination of technologies such as PiP(Package in Package), PoP(Package on Package), Stack, etc. Different bonding technologies, such as Wire bonding, Flip Chip and hybrid-type, are widely defined. MCM focuses on multi-chip co-packages, as opposed to the previous BGA to Flip Chip BGA type single-chip packages. In addition, Embedded technology is an important technology development, Embedded components can be Embedded active(IC) and passive(mainly RCL passive components). Currently, embedded RCL passive module technology is relatively mature, and the manufacturing process can be divided into two categories: BARED technology, which SMDS RCL components directly onto the substrate and then laminates it, and embedded technology, which uses no components (replacing RCL with materials). Because SiP technology development for many years, from the current packaging technology transfer feasibility is higher, and can significantly reduce the volume and improve signal reliability, the Handset will be used in a large number of products, and mass production line established, soon spread to other products.
