Rigid-Flex PCBA design and manufacturing
Reinforcing material: glass fiber cloth base
Insulating resin: polyimide resin (PI)
Product thickness: soft plate 0.15mm;
Hardboard 0.5mm; (tolerance ± 0.03mm)
Single-chip size: it can be customized according to customer supplied drawings
Copper foil thickness: 18 μ m(0.5oz)
Solder resist film / oil: yellow film / black film / white film / green oil
Coating and thickness: OSP (12um-36um)
Fire rating: 94-V0
Temperature resistance test: thermal shock 288 ℃ 10sec
Dielectric constant: Pi 3.5; AD 3.9;
Processing cycle: 4 days for samples; 7 days of mass production;
Storage environment: dark and vacuum storage, temperature < 25 ℃, humidity < 70%
Product features:
1. iPCB can be customized to process HDI blind hole impedance process and other difficult Rigid-Flex PCBA design and manufacturing;
2. Support OEM and ODM OEM, from drawing design to circuit board production and SMT processing, and cooperate with suppliers with one-stop service;
3. Strictly control the quality and meet the ipc2 standard;
Scope of application:
Products are widely used in mobile phones, home appliances, industrial control, industry, and other fields.
