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Model : 2+N+2 Mobile Main Board
Layers : 8Layers
Material : TG170 FR4
Construction : 2+4+2 HDI PCB
Finished Thickness：0.8mm
Copper Thickness : 0.5OZ
Color : Green/White
Surface Treatment：Immersion Gold+OSP
Min Trace / Space：3mil/3mil
Min Hole：Laser Hole 0.1mm
Application : Mobile Main Board
HDI is the abbreviation of high density interconnector. High density interconnection (HDI) manufacturing printed circuit board (PCB) is a structural component formed by insulating material supplemented with conductor wiring. When printed circuit boards are made into final products, integrated circuits, transistors (transistors, diodes), passive components (such as resistors, capacitors, connectors, etc.) and various other electronic components will be installed on them. With the help of wire connection, electronic signal connection and function can be formed. Therefore, printed circuit board is a kind of platform to provide component connection, which is used to undertake the substrate of contact parts.
2+N+2 HDI PCB Structure
Model : 2+N+2 Mobile Main Board
Layers : 8Layers
Material : TG170 FR4
Construction : 2+4+2 HDI PCB
Finished Thickness：0.8mm
Copper Thickness : 0.5OZ
Color : Green/White
Surface Treatment：Immersion Gold+OSP
Min Trace / Space：3mil/3mil
Min Hole：Laser Hole 0.1mm
Application : Mobile Main Board
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