PCB科技 - 高可靠性PCB的特點

1 Use internationally well-known substrates-do not use "local" or unknown brands

Benefit:

Improve 可靠性 and known performance

Risk of not doing so:

Poor mechanical performance means that the circuit board cannot perform the expected performance under assembly conditions. 例如, 高膨脹效能可能導致分層, 斷開和翹曲. 電力特性减弱可能導致阻抗效能不佳.

2 25. micron hole wall copper thickness

Benefit:

Enhance reliability, 包括提高z軸的膨脹阻力.

Risk of not doing so:

Blow holes or degassing, electrical connectivity problems during assembly (inner layer separation, hole wall fracture), 或實際使用中負載條件下的故障. IPCClass2 (the standard adopted by most factories) requires 20% less copper plating.

3 No welding repair or open circuit repair

Benefit:

Perfect circuit can ensure reliability and safety, 無需維護, no risk

Risk of not doing so:

If repaired improperly, 電路板會斷開. 即使修復是“適當的”, there is a risk of failure under load conditions (vibration, 等.), 可能導致實際使用失敗.

4. Requirements for the depth of the plug hole

Benefit:

High-quality plug holes will reduce the risk of failure during assembly.

Risk of not doing so:

The chemical residues in the gold-immersion process may remain in the hole that is not full of the plug hole, 導致可焊性等問題. 此外, 洞裏可能藏著錫珠, 在裝配或實際使用過程中可能飛濺, 導致短路.

5. Cleanliness requirements exceeding IPC specifications

Benefit:

Improving PCB cleanliness can increase reliability.

Risk of not doing so:

Residues and solder accumulation on the circuit board bring risks to the solder mask. 離子殘留物會在焊接表面造成腐蝕和污染風險, which may lead to reliability problems (bad solder joints/electrical failures) and ultimately increase the occurrence of actual failures Probability.

6. Lianshuo Circuit performs specific approval and ordering procedures for each purchase order

Benefit:

The execution of this program ensures that all specifications have been confirmed.

Risk of not doing so:

If the product specifications are not carefully confirmed, 在裝配或最終產品之前，可能不會發現產生的偏差, 現在已經太晚了.

7 Strictly control the service life of each surface treatment

Benefit:

Solderability, reliability, and reduce the risk of moisture intrusion

Risk of not doing so:

Due to the metallographic changes in the surface treatment of the old circuit boards, 可能出現焊接問題, 水分侵入可能導致分層等問題, separation (open circuit) of the inner layer and the hole wall during the assembly process and/或實際使用 .

8. 覆銅板的公差符合IPC4011CLASSB的要求/L

Benefit:

Strictly controlling the thickness of the dielectric layer can reduce the deviation of expected electrical performance.

Risk of not doing so:

The electrical performance may not meet the specified requirements, 和輸出/同一批組件的效能會有很大不同.

9. Define solder mask 材料 to ensure compliance with IPC-SM-840ClassT requirements

Benefit:

iPCB Circuits recognizes "excellent" inks, 實現墨水安全, 並確保阻焊油墨符合UL標準.

Risk of not doing so:

Inferior inks can cause adhesion, 磁通電阻和硬度問題. 所有這些問題都會導致阻焊板與電路板分離, 最終導致銅線腐蝕. 絕緣效能差可能會由於意外的電力連續性而導致短路/弧.

10. 定義形狀公差, holes and other mechanical features

Benefit:

Strict tolerance control can improve the dimensional quality of products-improve fit, shape and function

Risk of not doing so:

Problems in the assembly process, 例如對齊/fitting (the problem of press-fitting needles will only be discovered when the assembly is completed). 此外, 由於尺寸偏差增大, 安裝底座時會出現問題.

11. Lianshuo Circuits指定焊接掩模的厚度, although IPC does not have relevant regulations

Benefit:

Improve the electrical insulation properties, 降低剝離或附著力損失的風險, 無論在何處發生機械衝擊，都能增强抵抗機械衝擊的能力!

Risk of not doing so:

Thin solder mask can cause adhesion, 磁通電阻和硬度問題. 所有這些問題都會導致阻焊板與電路板分離, 最終導致銅線腐蝕. 由於薄的焊接掩模，絕緣效能較差，可能會因意外導電而導致短路/弧.

12. 定義了外觀要求和維修要求, although IPC does not define

Benefit

Careful care and carefulness in the manufacturing process create safety.

Risk of not doing so:

Various scratches, 輕傷，輕傷, 修理電路板工作正常，但看起來不太好. 除了表面上可以看到的問題之外, 哪些是看不見的風險, 對裝配的影響, 以及實際使用中的風險?

13. Sockets with scrap units are not accepted

Benefit:

Not using partial assembly can help customers improve efficiency.

Risk of not doing so:

A defective board requires a special assembly procedure. If it is not clear to mark the scrap unit board (x-out) or not isolate it from the board, 可以組裝這個已知的壞板, 囙此浪費了零件和時間.

14. PetersSD2955 specifies the brand and model of peelable blue glue

Benefit:

The designation of peelable blue glue can avoid the use of "local" or cheap brands.

Risk of not doing so:

Inferior or cheap peelable glue may foam, 熔化, 裝配過程中混凝土開裂或凝固, 使可剝離的膠水無法剝離/不工作.