PCB科技 - 如何處理PCB多層板內層發黑

如何處理PCB多層板內層發黑

對於 電路板製造商, 如果 PCB多層板 是多層板, 內層發黑是一個非常困難的問題, 那麼如何將其變黑? 發黑的效果是什麼?

發黑效果：鈍化銅表面； 提高銅箔內層表面粗糙度, thereby enhancing the bonding force between the epoxy resin board and the inner layer 屬於 copper foil;

tear strength peelstrength

Black oxidation method for general inner layer treatment of PCB多層板：

PCB多層板 黑色氧化處理

PCB多層板 棕色氧化法

PCB多層板 低溫發黑法

PCB多層板 採用高溫發黑法, the inner layer board will produce high temperature stress (thermalstress) which may cause the layer separation after la最小值ation or the crack of the inner layer copper foil;

1. Brown oxidation:

The product of black oxidation treatment of PCB多層電路板 of 電路板製造商 主要是氧化銅, 沒有所謂的氧化亞銅. 這是業內的一些錯誤論點. After ESCA (electrospecific chemical analysis) analysis, it can be determined

The binding energy between copper atoms and oxygen atoms, 氧化物表面銅原子和氧原子的比率； 清晰的數據和觀察分析證明發黑的產物是氧化銅, and there are no other components;

The general composition of blackening liquid:

oxidant sodium chlorite

PH buffer trisodium phosphate

sodium hydroxide

Surfactant

or basic copper carbonate ammonia solution (25% ammonia water)

2. Related data

1. Peelstrength 1oz銅箔的速度為2mm/min, 銅箔的寬度為1/8英寸, 拉力應大於5磅/英寸.

2, the weight of oxide (oxideweight); it can be measured by gravimetric method, 一般控制在0.2---0.5mg/平方釐米.

3. The significant factors that affect the tear strength through the related variable analysis (ANDVA: the analysis of variable) mainly include:

1. The concentration of sodium hydroxide

2. The concentration of sodium chlorite

3. The interaction between trisodium phosphate and immersion time

4. The interaction between sodium chlorite and trisodium phosphate concentration

"Tear strength depends on the filling of the resin to the oxide crystal structure, 囙此，它也與層壓的相關參數和樹脂pp的效能有關.

氧化物針狀晶體的長度為0.05mil (1-1.5um) as the best, 而且此時撕裂强度也比較大；