PCB技術 - PCB回路基板製造工程

PCB回路基板製造工程

1, open material

Purpose: According to the requirements of the エンジニアリングデータ MI of the PCB回路基板(深センPCBメーカー), 要件を満たす大きなシートは、50の小さな断片に切られます 回路基板 板を作る. 顧客要件を満たす小さなシート.

process: large sheet - cutting board according to MI requirements - curium board - beer fillet edging - plate out

2, drilling

Purpose: According to the PCB回路基板 engineering data, 必要なサイズを満たすシート材料上の対応する位置に必要な開口部をドリルする.

process: stacking plate pin - upper plate - drilling - lower plate - inspection and repair

3, heavy copper

Purpose: Immersion copper is to deposit a thin layer of copper on the wall of the insulating hole by chemical method.

process: rough grinding - hanging board - automatic copper sinking line - lower board - dipping% dilute H2SO4 - thickened copper

4, graphics transfer

Purpose: Graphic transfer is to transfer the image on the production film to the PCB回路基板.

Process: (blue oil process): grinding plate - printing the first side - drying - printing the second side - drying - exploding - developing shadow - inspection; (dry film process): hemp board - pressing film - standing - right Position-Exposure-Standing-Development-Check

5. Graphic plating

Purpose: Pattern electroplating is to electroplate a copper layer with the required thickness and a gold-nickel or tin layer with the required thickness on the bare copper skin or hole wall of the circuit pattern.

process: upper board - degreasing - second water washing - micro-etching - water washing - pickling - copper plating - water washing - pickling - tin plating - water washing - lower board

6, Remove the film

Purpose: Use NaOH solution to remove the anti-plating coating film to expose the non-circuit copper layer.

process: water film: insert rack - soak alkali - rinse - scrub - pass machine; dry film: release board - pass machine

7, etching

Purpose: Etching is to use a chemical reaction method to corrode the copper layer of non-circuit parts.

8, green oil

Purpose: Green oil is to transfer the graphic of the green oil film to the board to protect the circuit and prevent the tin on the circuit when welding parts.

Process: grinding plate-printing photosensitive green oil-curing plate-exposure-exposure; grinding plate-printing first side-drying plate-printing second side-drying plate

9, characters

Purpose: Characters are provided as a mark for easy identification.

Process: After the green oil finishes - cool and stand - adjust the screen - print characters - back

10, gold-plated fingers

Purpose: to plate a nickel-gold layer of required thickness on the plug finger to make it more hard and wear-resistant.

process: upper plate - degreasing - washing twice - micro-etching - washing twice - pickling - copper plating - washing - nickel plating - washing - gold plating

spray tin plate (a process in parallel)

Purpose: Multilayer circuit board spray tin is to spray a layer of lead tin on the bare copper surface that is not covered with solder mask to protect the copper surface from corrosion and oxidation to ensure good soldering performance.

process: micro-etching - air drying - preheating - rosin coating - solder coating - hot air leveling - air cooling - washing and air drying

11, molding

Purpose: Organic gongs, ビアボード, ハンドゴング, hand-cutting methods to produce the shape required by the customer through die stamping or CNC gong machine

Description: The accuracy of the PCB回路基板 データゴングマシンボードとビールボードが高い. 手のゴングは2番目です, そして、最小限の手を切るボードだけのいくつかの簡単な形で行うことができます.

12, test

Purpose: Through the electronic test fixture/フライングプローブテスト, 視覚的に見つからないオープン回路や短絡などの機能に影響する欠陥を検出する.

Process: upper mold - release board - test - pass - FQC visual inspection - unqualified - repair - return test - OK - REJ - scrap

13, final inspection

Purpose: Visually inspect the appearance of the board and repair minor defects to avoid problems and the outflow of defective boards.

特定の作業フロー：着信材料-チェック情報-視覚検査-修飾- fqaスポットチェック-修飾-包装-無条件-処理-点検OK