電子設計 - 回路基板設計仕様厚銅ボード設計仕様

回路基板設計 specification-thick copper board design specification

基板厚さが2オンス以上のPCB回路基板においては、基板厚によって回路基板設計仕様は一般的な回路基板と異なる。このため、特別な品質の回路基板を提供できるように、特別に厚い銅板の書類検査仕様を指定する。

1: Wire design specification for 回路基板 design
A: The minimum wire width of the 回路基板 is not less than 0.3mm;
B: In general, the distance between adjacent wires should not be less than 0.25 mm
C: The copper foil around the fixing hole is not less than 0.穴の端から4 mm；細いワイヤー1はありません.5 mm from the edge of the hole
E: Whether to consider low-density wiring design
F: Whether the wires are laid out according to the shortest route, and whether there will be no sharp angles at the turn
G: Whether the junction between the wire and the pad is smoothed into a slope
H: In the power circuit, the distance between adjacent wires between hot and cold ground should not be less than 6mm
I: The distance between the wire and the edge of the printed board is generally not less than 3mm, 特に1以上.5 mm, しかし、配線幅は1未満であってはならない.5 mm；接地線は0以下であってはならない.5 mm

2: Design specification of pads for 回路基板 design

A: The distance between the pad of the interposing component and the edge of the printed board is generally not less than 7mm, 特に3以上.5mm. The distance between the pad and the edge of the mounted component should not be less than 5mm; The physical and pad distance of the interposing component or the mounting component should not be less than 5mm from the edge of the board
B: For ICs with a 1.78 mmピンピッチ, the connection (pad) pitch should not be less than 0.3mm
C: The minimum diameter of the circular pad, whether it meets the standard
D: After the wave soldering of the components inserted, whether the pads are driven away from the tin bath
E: There must be no connection between the pads, between the pads and the exposed copper foil
F: Whether the pads of the switching transformer and the harmonic current suppressor are removed from the empty pads to prevent mis-insertion
G: The filter inductance of the AC input circuit, スイッチングトランスのパッドかどうか, インバータトランス, ハイパワー抵抗器, high-power damping or rectifier straddle diode (non-plastic package), and rectifier large electrolytic capacitor are reinforced with rivets
H: The number of rivet pads of multi-pin component pads, 一般的に1未満であるべきではない/2 of the number of pins of the component
I: Whether the design requirements of the rivet hole pad meet the standard; the rivet pad with a 1.8 mmの開口部は4です.5mm. 条件が満たされなければ, A 4.0 mmパッドを使用し、液滴形状の上部スズ補強が必要である. 2のリベットパッド.4 mmの開口部は5です.5mm, 満足なら, 使用5.0mm pad and add drop-shaped upper tin reinforcement
J: Take the printed board positioning hole as the center, リベットパッドは半径7 mm以内に設計されていない, and rivet pads are not designed for adjacent holes with a distance of less than 6mm
H: Whether the key components are reinforced with rivets, and whether the pads of the key components are tinned with water droplets

3：回路基板設計のための熱設計仕様

A: Whether the thermal element is far away from the heat sink
B: Are there heat dissipation measures for high-power components?
C: The distance between the high-power heating device and the large-volume electrolytic capacitor must be greater than 5mm
D: Have you considered the heat conduction facilities of the device?
E :ラジエータの固定と位置は適切ですか?
加熱装置は、対応するプリント基板の下およびその周囲に適切な量の放熱穴を有するべきである, and the diameter is generally not greater than 4mm
G: Large-area copper foil is easy to be heated to produce copper foil expansion, そして、面積は15 mmの円の直径を超えます, the conductive layer must be opened with a conductive window

4: Layout design specifications for 回路基板 design

A: Is it possible to complete production through the simplest assembly process?
ハイパワーデバイスのレイアウトが均一かどうか, 放熱流方向が考慮されるかどうか, and the board strength
C: Is the fixing device added to the high-quality device?
D :デバイスの絶縁対策を考えましたか?
E: Whether the arrangement of components is horizontal or vertical
F: The radiator must not touch the surrounding components
G: Whether the design of the cushion position is evenly distributed
H: Whether there are nail bottom components and flying leads
I: Whether the heat sink installation complies with the heat dissipation flow direction, and whether to use the existing heat sink as much as possible to reduce the possibility of making a new heat sink
J: Whether the maximum PCB board length is not more than 600mm, and the width is not more than 360mm
K: Are there grounding lugs at the fixed holes for cold ground installation? 接地ラグは十分か?
基板の銅箔面に3つ以上のグローバルマークポイントがあるかどうか, and whether the increased position meets the process requirements and affects the safety distance
M: Whether the arrangement of the vertical electrical plug-in components can ensure that the outer edge distance between the pieces is more than 1mm
N: Whether there are solder pads and copper foil on the edge of the printed board, making assembly more difficult
O: Whether the vertical board considers the fixing method
P: Whether the components fixed on the heat sink leave a space that can be disassembled without disassembling the heat sink
Q: Are there tall and dense components or sharp radiator corners around the power strip?
R: Whether the placement position of the input and output power strips meets the convenience of connecting with other boards of the whole machine
S: Whether the SMD components are placed perpendicular to the long side of the board to avoid fracture or damage due to deformation
T: Whether the plug-in IC and the chip IC are placed horizontally and the direction of the wave soldering is consistent with the wave soldering process, and whether the IC is designed with tin-theft pads in the appropriate position during the wave soldering to avoid continuous soldering of the soldering pads
U: Whether to consider avoiding shadow effects when placing all SMD components
V: Is there any positional interference between the screws of the fixed components and the radiator and the components on the board?

溶接設計仕様 回路基板 design
A: Whether there is a 3mm wide reserved bracket position in the middle of the PCB board that is wider than 180mm or longer than 320mm through wave soldering
B: The reserved position of the support bar should not be within the bending range of the component lead
C: Components that are not suitable for wave soldering due to structural limitations, 波クレストと反対の位置で錫浴を追加する必要があります, スロット幅は0です.7mm
D: The direction of wave soldering needs to be clearly marked on the upper and lower sides of the board
E: Try not to lay out components like horizontal plug-in wires that extend out of the edge of the board.
電気プラグ部品のリード線の曲げ, トライオード周辺, ICソケットソケットパッド, should be coated with a secondary solder mask
G: A large area of copper foil is easy to be heated to produce copper foil expansion, それで、面積は15 mmの円の直径を超えます, 導電層は導電性窓またはグリッドを開く必要がある