PCBニュース - PCBコンポーネントライブラリ命名規則

1. Integrated circuit (in-line)
   Use DIP-pin number + suffix to indicate dual in-line package
   There are two suffixes, NとW, to indicate the body width of the device
   N is a narrow package with a body width of 300mil and a pin pitch of 2.54mm
   W is the package with body width, ボディ幅は600ミルです, ピンピッチは2です.54mm
   For example: DIP-16N represents a 16-pin narrow dual-in-line package with a body width of 300mil and a pin pitch of 2.54mm

2. 統合化PCB circuit (SMD)
Use SO-pin number + suffix to indicate small outline SMD package
There are three suffixes of N, M and W to indicate the body width of the device
N is a narrow package with a body width of 150mil and a pin pitch of 1.27mm
M is a package between N and W, 208ミリメートルのボディ幅と1のピンピッチで.27mm
W is the package with body width, ボディ幅は300ミルです, ピンピッチは1です.27mm
For example: SO-16N represents a 16-pin small-outline chip package with a body width of 150mil and a pin pitch of 1.27mm
If SO is preceded by M, それは、ボディ幅が118ミリメートル、ピンピッチが0のマイクロパッケージであることを意味します.65mm

3. Resistance
3.1 The naming method for SMD chip resistors is: package + R
Such as: 1812R represents a resistor package with a package size of 1812
3.2 The naming method for carbon film resistors is: R-package
For example: R-AXIAL0.図6はパッドピッチ0の抵抗パッケージを示す.6 inches
3.3 The naming method of cement resistance is: R-model
Such as: R-SQP5W represents a cement resistor package with a power of 5W

4. Capacitance
4.1 The naming method for non-polar capacitors and tantalum capacitors is: package + C
Such as: 6032C means that the package is 6032 capacitor package
4.2 The naming method of SMT monolithic capacitors is: RAD + pin spacing
For example: RAD0.2 means SMT monolithic capacitor package with a pin pitch of 200mil
4.3 The naming method of electrolytic capacitors is: RB+pin spacing/outer diameter
For example: RB.2/.4 means an electrolytic capacitor package with a pin pitch of 200mil and an outer diameter of 400mil

5. Diode rectifier device
The naming method is based on the actual package of the component, where BAT54 and 1N4148 are packaged as 1N4148

6. Transistor
The naming method is based on the actual package of the component. 集積回路のSOT - 23パッケージを区別するために、SOT - 23 QパッケージにQを追加する. 他のFETは、部品名をパッケージ名として使用して、部品を呼び出しずに、部品名を呼ぶ.

7, crystal oscillator
HC-49S, 表面実装パッケージ, AT 26, AT 38は円筒形パッケージ, and the size of the digital meter
For example: AT26 represents a cylindrical package with an outer diameter of 2mm and a length of 8mm

8. Inductance and transformer parts
Inductive sealing package adopts TDK company package

9. Optoelectronic devices
9.1 The naming method of SMD LED is package + D to indicate
Such as: 0805D means light-emitting diode packaged as 0805
9.2 In-line light-emitting diodes are expressed as LED-outer diameter
For example, LED-5 represents a direct plug-in light-emitting diode with an outer diameter of 5mm
9.3 The nixie tube uses the device's own name naming

10. Plug
10.1 SIP + number of pins + pin spacing to indicate a single row of pins, ピン間隔の2種類があります, 2.54mm
For example: SIP7-2.54はピン2のピンピッチを持つ7ピン単一行ピンを意味する.54mm
10.2 DIP + number of pins + pin spacing to indicate double row of pins, ピン間隔の2種類があります, 2.54mm
For example: DIP10-2.ピンはピン2のピンピッチで10ピンの二行ピンを意味します.54mm

The above is an introduction to the naming rules of PCB component libraries. IPCBも提供されて PCBメーカー and PCB製造 テクノロジー.