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Oro químico de níquel(ENIG)
Nickel gold is a relatively large surface treatment process. La capa de níquel es una capa de aleación de níquel - fósforo. Según el contenido de fósforo, Se divide en níquel fosfórico alto y níquel fosfórico Medio. Las aplicaciones son diferentes.
The advantages of nickel-gold:
Suitable for lead-free soldering-->The surface is very flat, suitable for SMT-->Through holes can also be coated with nickel and gold-->Long storage time, storage conditions are not harsh-->Suitable for electrical testing-->Suitable for switch contact design -->Suitable for aluminum wire binding, Adecuado para placas gruesas, Una fuerte resistencia a los ataques ambientales.
2. Chapado de níquel y oro
El níquel - oro galvanizado se divide en "oro duro" y "oro blando".. Hard gold (such as goldcobalt alloy) is commonly used on gold fingers (contact connection design), El oro suave es oro puro.. La galvanoplastia de níquel y oro se utiliza ampliamente en: Sustrato de circuito integrado((por ejemplo, pbga)). Se aplica principalmente a la soldadura de alambre de oro y alambre de cobre. Sin embargo,, El recubrimiento del sustrato IC es adecuado. El área de Unión del dedo de oro requiere cableado adicional galvanizado.
The advantages of electroplating nickel gold:
Long storage time>12 months-->Suitable for contact switch design and gold wire binding-->Suitable for electrical test
Weaknesses of nickel-gold electroplating:
Higher cost, thicker gold-->Additional design wire conductivity is needed when electroplating gold fingers-->Because the thickness of gold is not constant, Debido a que el oro es demasiado grueso, las juntas de soldadura pueden volverse frágiles y afectar la resistencia de la soldadura..--> The problem of surface uniformity of electroplating-->The electroplated nickel and gold do not cover the edge of the wire-->It is not suitable for aluminum wire bonding. Not suitable --> High storage conditions are required.
Ventajas y desventajas PCB circuit board tin spraying
Tin spraying was a common treatment in the early days of PCBs. Ahora se divide en estaño sin plomo y estaño sin plomo.
The advantages of tin spraying:
Long storage time -->After the PCB is completed, the copper surface is completely wetted (the tin is completely covered before soldering)
Suitable for lead-free soldering-->Mature process-->Low cost-->Suitable for visual inspection and electrical measurement
Weaknesses of tin spraying:
-->Not suitable for wire bonding; due to surface flatness, there are limitations on SMT; not suitable for contact switch design --> Copper will dissolve when spraying tin, and the board will withstand a high temperature --> Especially thick or thin board, Limitación de la pulverización de estaño, Operación de producción inconveniente.
