PCBニュース - 世界のHDI PCB市場は2019年から2025年の間に12.8 %のCAGRを目撃する

NEW YORK, 5月15日, 2019 (GLOBE NEWSWIRE) -- The global HDI printed circuit board market is anticipated to reach USD 24.2025年までの63億円, while augmenting at a CAGR of 12.8 %. The market growth is attributed to the increasing miniaturization of electronic devices, スマートデバイスに向けた消費者の急速な傾斜, and significant growth in consumer electronics as well as increasing adoption of safety measures in automobile. Additionally, increasing adoption of smart wearables is also likely to fuel the demand for high density interconnects PCBs over the forecast period. しかし, the high cost coupled with lack of expertise in manufacturing HDI printed circuit board is expected to impede the market growth to during 2019-2025.

高密度相互接続PCB 従来のPCBより高い回路密度を作るのを援助するプリント回路基板製造技術の進化. HDI printed circuit board offers an ability to place more コムponents on both sides of the PCBs, 信号伝達速度の高速化と信号損失の低減. Moreover, ルーティングの高速化, minimize the frequent relocation of components, より少ないスペースを利用する. Furthermore, 埋め込みデバイスの電気性能を向上させるだけでなく、小型化を図る.

Key Findings of the Report:

The global HDI printed circuit board market is expected to reach USD 24.2025年までの63億円, at a CAGR of 12.68%

Based on Layers, 12 and above layers is estimated to register the highest CAGR over the forecast period. セグメント成長は、モバイルデバイスのような多くのアプリケーションにおいて、HDIプリント回路基板の増大する展開に起因する, 自動車製品等.

Based on application, スマートフォンとタブレットセグメントは2018年に主要な市場シェアを占めた, and expected to retain its dominance during 2019-2025

Based on エンドユース, 家電市場は2018年に市場を支配すると予想されている, whereas industrial electronics segment is likely to emerge as the fastest growing segment over the forecast period.

Prominent players operating in the HDI printed circuit board market include Unimicron Corporation; AT&S; TTM Technologies; Zhen Ding Tech; Epec, LLC.; ユニテックNCABグループシエラ回路ミレニアムサーキットミストラルソリューション. Ltd. 中でも.
Rapid Deployment of High Density Interconnect PCB across various End-Use Industries

The substantial increase in the sales of consumer electronics along with the growing demand for high density printed circuit boards in many end-use applications is likely to foster the market growth. Additionally, lightweight and high performance of HDI printed circuit boards is making them suitable for powering wearable devices. その他, HDI printed circuit board utilizes a combination of advanced features such as blind vias, そして、そのパフォーマンスと機能を増やしている間、板のスペースを最大にする他のものの中のMicrovias. Furthermore, 自律的な運転と洗練された安全システムに向けての増加傾向は、予測期間に対する需要のより多くの機会を生み出す.

Browse full research report with TOC on "Global High Density Interconnect (HDI) Printed Circuit Board (PCB) Market Outlook, トレンド・機会分析, Competitive Insights, Actionable Segmentation & Forecast 2019-2025" at: https://www.エネルギー市場調査.com/global-high-density-interconnect-hdi-printed-circuit-board-pcb-market-report/

Global High Density Interconnect PCB - Regional Insight

Geographically, the global HDI printed circuit boards market is segmented into North America, アジア太平洋, ヨーロッパ, Middle East and Africa, and Central & South America. North America is accounted to hold the largest market share in 2018, 自動車部門からのHDIプリント回路基板の需要増加と結合したスマートウェアーブルの採用の増加により. しかし, Asia-Pacific is likely to emerge as the fastest growing region in the HDI printed circuit board market, そして2019年から2025年の間に市場を支配すると予測した. The presence of major electronics and semiconductor manufacturers and rapid expansion of telecommunication network in emerging economies is estimated to augment the market growth during the forecast period.

The report segments the global HDI printed circuit board market on the basis of layer, application, end-use, and region.

By Layer
○ 4-6 layers
○ 8-10 layers
○ 12 and above layers
Application
○ Smartphone and Tablet
○ Laptops and PCs
○ Displays
○ Connected Devices
○ Smart Wearables
○ Others
End-Use
○ Consumer electronics
○ Industrial Electronics
○ Military and defense
○ IT & Telecommunication
○ Automotive
○ Healthcare
○ Others
By Region:
○ North America
• U.S.
• Canada
○ Europe
• UK
• Germany
• France
• Russia
• Rest of Europe
○ Asia-Pacific
• China
• Japan
• India
• South Korea
• Rest of Asia-Pacific
○ Central and South America (CSA)
• Brazil
• Mexico
• Rest of CSA
○ Middle East and Africa (MEA)
• South Africa
• Rest of MEA
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