PCB Technical - Printed circuit board production process

Printed circuit board production process
1. Process flow of single-sided printed board:
Blanking - Screening Missing - Corrosion - Removal of Printing Material - Hole Processing - Printing Mark - Applying Flux - Finished Product.
2. Process flow of multilayer printed board:
Inner layer material processing - positioning hole processing - surface cleaning treatment - inner layer wiring and graphics - corrosion - pre-laminating treatment - outer and inner layer material lamination - hole processing - hole metalization - refers to outer layer graphics - plating corrosion resistance Weldable metal-Removal of sense-Light glue corrosion-Plug gold plating-Shape processing-Hot melt-Flux application-finished product.
The function of the printed circuit board

The printed circuit board has the following functions in electronic equipment:
Provide mechanical support for the fixing and assembly of various electronic components such as integrated circuits, realize the wiring and electrical connection or electrical insulation between various electronic components such as integrated circuits, and provide the required electrical characteristics.
Provide solder mask graphics for automatic welding, and provide identification characters and graphics for component insertion, inspection, and maintenance.
After electronic equipment adopts printed boards, due to the consistency of similar printed boards, manual wiring errors can be avoided, and electronic components can be automatically inserted or mounted, automatic soldering, and automatic detection, ensuring the quality of electronic products. Improve labor productivity, reduce costs, and facilitate maintenance.
The development trend of printed circuit boards
Printed boards have developed from single-layer to double-sided boards, multilayer boards and flexible boards, and continue to develop in the direction of high precision, high density and high reliability. Continuously shrinking volume, reducing costs, and improving performance have enabled printed boards to maintain strong vitality in the development of electronic products in the future.
The future development trend of printed board manufacturing technology is to develop in the direction of high density, high precision, fine aperture, fine wire, small pitch, high reliability, multilayer, high-speed transmission, light weight, and thinness in performance.
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