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A hybrid printed circuit board (PCB) multilayer is a PCB that uses dissimilar materials with the intent of optimizing electrical performance and improving system reliability focused towards high-frequency RF applications. The biggest challenge when manufacturing this type of PCB is managing the different coefficient of thermal expansion (CTE) properties of the dissimilar circuit materials both during PCB fabrication and component assembly.
Typically these designs include a combination of FR-4 material and PTFE laminates which allows a designer to condense both RF functionality and RF functionality on the same PCB which can reduce both the footprint of the device and the costs.
