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sales@ipcb.com
2021-10-05
бронзовая плита является важной частью конструкции PCB. как отечественные, так и зарубежные компании "Protel, Power"...
Quality requirements for circuit board solderingThe two major American electronic and electrical industry associations (...
There are many ways to solve EMI problems. Modern EMI suppression methods include: using EMI suppression coatings, selec...
Analysis of the reason why there is no copper in the copper sinking of the PCB board. The use of different resin systems...
Для производителя PCB, принцип обработки проходного отверстия паяльного диска в сварной диске очень головная боль...
The purpose of this document is to explain the process and some precautions of PCB design using the PCB design software powerpcb of pads, provide design specifications for designers of a working group, and facilitate communication and mutual inspection among designers.
Circuit board package BGASince Motorola introduced semiconductor components in the "ball-foot grid package" in...
Для изучения оптимального метода сварки плат PCB основное введение: 1 - эффект увлажнения олова.
Как анализировать, определять и уточнять причины падения проблемных деталей плат при падении компонентов плат.
Transient responses in interconnects and on power lines in PCB board are responsible for bit errors, timing jitter, and other signal integrity problems.
производство зеленой краски для производства платы BGAPPB производители, зеленый лак, строительство шаровой прокладки...
PCB wiring is to lay the roads for energizing signals to connect various devices. This is like building roads and connec...
The interconnection of circuit board system includes chip to circuit board, interconnection in PCB and interconnection between PCB and external devices.
In high-speed PCB boards, routing is more than just connecting two points. As a qualified engineer, wiring is a mixed kn...
The reasons for Open include poor solder paste printing, mobilization after placement, poor coplanarity, or poor solderability of the pcb board surface pad.
Generally, the requirements for the structure design and process manufacturing of multi-layer circuit boards are very hi...
Explain high-precision multi-layer PCB circuit board processingWith the development of modern electronic technology and ...
The aging and deterioration of the solder joint strength of the circuit board1. Aging of solder jointsAfter the welding ...
В последние годы, с появлением больших данных и расширением технической сферы, появилось много задач, которые, как представляется, не имеют отношения к делу...
Reliability of circuit board ball foot solder joints1. The difference of local thermal expansion coefficientSince the CT...
