Технология PCB - PCB пробное хранение PCB

Now it has become a high-paying industry, много еще корректор печатных плат with good quality and low prices on the market have very wide applicability. выбор высококачественных образцов PCB является конечной целью для многих потребителей. Однако, I think that in addition to choosing a good quality PCB for proofing, the maintenance of the PCB at the end of the proofing is actually more important. Но как сохранить PCB?
PCB пробное обслуживание one:
Regular cleaning: аfter long-term use, there will be some use residues and solder accumulation on the PCB proofing circuit board, Это создает непредсказуемый риск для сварочного фотошаблона, and even these residues may directly lead to corrosion and corrosion of the soldering surface. риск загрязнения, Это может привести к проблемам надежности, such as defective solder joints or electrical failures, и увеличить вероятность провала PCB. Regular cleaning can effectively improve the reliability of PCB proofing in use.
PCB proofing and maintenance two:
Strictly control the service life of each surface treatment, & Заменить поверхность образца PCB processor on time: The most prone problems of electronic products will also appear on PCB proofing. срок службы обработки каждой поверхности при отсутствии строгого контроля, PCB proofing may cause soldering problems due to metallographic changes in the surface treatment of the old панель PCB, если не обращать внимания на срок службы, it is easy to cause damage to the protective surface of the PCB proofing. Это может привести к попаданию влаги, which may cause problems such as delamination and internal disconnection during the assembly process or actual use. Однако, if you pay attention to the service life of the surface treatment in the later period, Вы можете эффективно повысить свариваемость защиты PCB и снизить риск проникновения влаги и повреждения других внутренних систем.
PCB пробное обслуживание three:
Use the designated brand and model of peelable blue glue for maintenance: using inferior and cheap peelable glue may blistering, расплавление, cracking or solidifying like concrete during the assembly of PCB proofing, Не удалять и не удалять.
зависимость размеров защитных покрытий PCB от средних нагрузок, cathode current density, плотность объемного тока, etc.;

PCB proofing Generally speaking, the size of the electroplating tank refers to the volume L of the electrolyte in the plating tank, также известный как эффективный объём, То есть, the length of the inner cavity of the electroplating tank X the width of the inner cavity X the depth of the electrolyte;
PCB proofing can generally be calculated and matched according to the electroplating processing volume or the existing DC electroplating equipment and other conditions;
Choosing the appropriate size of the electroplating bath is of great significance for preparing production plans, estimating production capacity and ensuring the quality of electroplating;
Three considerations for determining the size of the electroplating tank:
1. Meet the size requirements of processed parts;
2. Prevent the electrolyte from overheating;
3. Able to maintain a certain stability of electrolyte components during the electroplating production cycle;
The current density of the cathode and anode is calculated based on the total area actually immersed in the electrolyte. There is a slight difference due to the difference in the current efficiency of the cathode and anode;
DA=I total/S Yin (A/dm2)
DA=I total/S Yang (A/dm2)
Average loading d: the volume of electrolyte needed for electroplating parts per unit area
is d=V/S(L/ dm2)
Volume current density DV:
The intensity of the current passing through the unit volume is: DV=Itotal/V(A/L)
PCB proofing and electroplating process is important to properly control the volume current density, Потому что ток через электролит вырабатывает тепло от сопротивления раствора, приводить к повышению температуры электролита, скорость и высота нагрева электролита непосредственно связаны с плотностью объемного тока. In order to prevent the electrolyte from heating up too quickly, a larger volume of electrolyte is necessary to reduce the volume current density;
Such as acidic bright copper plating process: The appropriate volume current density is 0.3-0.4A/L, that is, when the total current is 1000A, 2500-3000L electrolyte should be equipped;
Empirical data:
PCB proofing The following data is some empirical data related to the cathode current density and average loading of various common plating species:
Plating species Cathode current density range DK, A/ dm2 Average loading d, L/ dm2
Sulphate copper plating 1.0 - 3.0 7---9
Acid tin plating 1.0 - 3.0 7---9
Bright nickel 2.0 - 4.0 6---8
Nickel 1.0 - 1.5 6---8