PCB News - PCB production process and manufacturing process

PCB circuit board production process and PCB manufacturing process
The inventor of the printed circuit board was Paul Eisler, an Austrian, who used the printed circuit board in a radio device in 1936. In 1943, the Americans used this technology extensively in military radios. In 1948, the United States officially recognized this invention for commercial use. Since the mid-1950s, printed circuit board technology has only begun to be widely adopted.

Before the advent of printed circuit boards, the interconnection between electronic components was achieved by direct connections. But now, the circuit panel only exists as an effective experimental tool; the printed circuit board has occupied an absolute dominant position in the electronics industry.
1. Detailed explanation of relevant design parameters:
one. line
1. Minimum line width: 6mil (0.153mm). That is to say, if the line width is less than 6mil, it will not be able to produce. If the design conditions permit, the larger the design, the better, the larger the line width, the better the factory, the higher the yield, and the general PCB design routine is about 10mil. This is very important, and the design must be consider
2. Minimum line spacing: 6mil (0.153mm). The minimum line distance is line-to-line, and the distance from line to pad is not less than 6mil. From the production point of view, the larger the better, the general rule is 10mil. Of course, if the design is conditional, the larger the better. This is very important. Design Must consider
3. The distance between the line and the outline line is 0.508mm (20mil)
two. via via (commonly known as conductive hole)
1. Minimum aperture: 0.3mm (12mil)
2. The minimum via hole (VIA) aperture is not less than 0.3mm (12mil), and the single side of the pad cannot be less than 6mil (0.153mm), preferably greater than 8mil (0.2mm), but not limited (see Figure 3) This point is very important, The design must be considered
3. The via hole (VIA) hole-to-hole spacing (hole side to hole side) cannot be less than: 6mil, preferably greater than 8mil. This point is very important, and the design must be considered
4. The distance between the pad and the outline line is 0.508mm (20mil
Third, the production process
Double-sided tin plate/immersion gold plate production process: cutting-drilling--sinking copper-circuit-drawing electricity-etching-solder mask ---Character----Spray tin (or heavy gold)-Gong edge-V cut (some boards don’t need)-----Fly test----Vacuum packaging
Multi-layer tin board/immersion gold board production process: cutting-inner layer--lamination-drilling--sinking copper-circuit--map electricity- ---Etching-----Solder Mask---Character----Spray Tin (or Immersion Gold)-Gong Edge-V Cut (Some Boards Not Needed)-----Fly Test---- Vacuum packaging