PCB News - What are the serious causes of PCB board heating?

What are the serious causes of PCB board heating?

In integrated circuits, excessively high temperatures can negatively affect functions, components, and the circuit board itself. So, what are the serious reasons for PCB board heating?

1. The component is not placed correctly

Certain high-power equipment needs to reserve a place for natural ventilation or forced ventilation to dissipate heat. If there is no proper airflow to dissipate heat, the PCB will accumulate most of the heat, leading to an increase in temperature, resulting in degradation or damage to the circuit performance. It should be noted that sensitive components should not be placed near components that emit a lot of heat; through proper heat dissipation and natural cooling or forced cooling, the temperature can be kept within a safe range.

2. Environment and external thermal factors

When the PCB is used in an extreme temperature environment, if the temperature conditions in the target environment are not considered in the design, the electronic components may be subjected to excessive pressure; general electronic component manufacturers will provide specifications that are applicable within a specific temperature range .

3. Incorrect selection of parts and materials

In the process of electronic component material selection, failure to follow the recommended usage guidelines may cause heat dissipation problems. When selecting electronic components, it is important to review detailed data and consider all relevant information related to power consumption, thermal resistance, temperature limits, and cooling technology. In addition, perform quick power calculations on the resistors to ensure that the power ratings suitable for the application are selected. Another problem is the choice of PCB dielectric materials. The printed circuit board itself must be able to withstand the worst-case thermal conditions.

4. Defects in PCB design and manufacturing

Poor layout and manufacturing processes can cause PCB thermal problems. Improper soldering may hinder heat dissipation, and insufficient trace width or copper area can also cause temperature rise. To prevent heat dissipation problems, designers must reduce heat dissipation and use other cooling techniques when natural cooling is insufficient; thermal optimization design requires attention to component specifications, PCB layout, PCB dielectric materials, and environmental conditions.