PCB Material List - PCB Material Data Sheet page 5

2020-10-05

The dielectric constant stability, loss factor and thickness consistency of Rogers kappa 438 are better than those of th...

2020-10-03

Rogers ad300 series are high frequency PCB materials for antennas.Ad series products combine fluoropolymer resin, specific ceramic filler and glass fiber support material to produce a series of dielectric laminates with low loss, strong mechanical toughness, stable dielectric constant and low PIM.

2020-10-03

Rogers(Arlon) ad250c, Rogers ad255c, Rogers ad260a microwave high frequency PCB materials are the third generation commercial microwave and RF laminates with low dielectric, low cost and excellent low loss characteristics.

2020-09-30

Rogers ro3203, ro3206 and ro3210 high frequency PCB circuit materials are laminates with ceramic filler and reinforced by woven glass cloth. These materials were developed to provide exceptional electrical and mechanical stability at competitive prices.

2020-09-30

The advanced pcb materials division of Rogers introduces rolled copper foil into its low dielectric constant ro3003, ro3...

2020-09-30

Rogers ro3006 PCB high frequency circuit material is PTFE composite with ceramic filler. The application of this material makes the dielectric constant of ro3006 have high temperature stability.

2020-09-28

Rogers RO4350B is a hydrocarbon / ceramic laminate with a dielectric constant of 3.48. It meets the requirements of commercial equipment manufacturers for printed circuit boards.

2020-08-28

The DK values of Rogers RO4360G2 and RO4730G3 are quite different. RO4360G2 is 6.15, and RO4730G3 is 3.0. Therefore, RO4360G2 is suitable for small volume design, and high Dk can be used to save boards.

2020-08-28

Rogers RT/duroid6202(Rogers 6202) high frequency circuit material is a low loss and low dielectric constant laminate, which has excellent electrical and mechanical properties in the design of complex microwave structures.

2020-08-28

Rogers RO4400 Series(RO4450F, RO4460G2) dielectric materials have long been used in combination with FR-4 cores and prepreg as a means to achieve a performance upgrade of standard FR-4 multi-layer designs.