PCB Material List - PCB Material Data Sheet page 8

2020-07-06

F4BM-2 & F4BM Radio frequency PCB material is laminated by laying up of woven glass fabric, bond film, with Teflon pcb resin and Polytrtrafluoroethylene(PTFE) film, according to the scientific formulation and strict technology process.

2020-07-04

Sharing the material specification parameters of PANASONIC MEGTRON4 Laminate R-5725 and R-5620. it's Low dielectric and high heat resistance PCB materials.

2019-11-14

IT-150GSThe IT-150GS is a medium Tg (>150° C by DSC), halogen free multifunctional epoxy and middle loss material wit...

2019-11-14

The ITEQ IT-170GRA1TC is a high Tg(180°C by DSC), halogen free epoxy and lower mid loss material with high thermal reliability, low CTE and CAF resistance. This green material is designed for industrial PC and 3S(server/storage/switch) application with aggressive cost.

2019-11-14

ITEQ IT-180 is a standard loss, high tg (175℃ by DSC) multifunctional filled epoxy with low CTE, high thermal reliability. It is designed for high layer count PCB and it can pass 260℃ Lead free assembly process.

2019-11-14

Sharing the material specification parameters of SY S1141 FR-4 PCB. ipcb provides batch high quality S1141 PCB.

2019-11-14

Features of s1600: excellent resistance to electric leakage and marking, CTI ≥ 600V. UV blocking. Excellent PCB processing. Not suitable for turning green oil (solder resist ink).

2019-11-14

Material we used: Ceramic-filled PTFE Composite for Rogers RO3003, It's good at high temperature, operating at 10GHz and temperature changes from -50℃ to +150℃,DK can reach -3ppm/℃,The RO3003 amintains a high permittivity frequency stability and can be used in a wide frequecny rang. RO3003 laminates also show a very low DF(0.0013)AT 10GHz.

2019-11-14

Rogers RO4835 material offer high stability at elevated temperatures and significant oxidation resistance.

2019-11-14

Rogers RO3010 advanced circuit materials are ceramic-filled PTFE composites that offer a higher dielectric constant with excellent stability.