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The DK values of Rogers RO4360G2 and RO4730G3 are quite different.
RO4360G2 is 6.15, and RO4730G3 is 3.0. Therefore, RO4360G2 is suitable for small volume design, and high Dk can be used to save boards.
Rogers RO4360G2 material specification
RO4360G2 and RO4730G3 Features
Dk of 6.15 +/- 0.15
Low dissipation factor of 0.0038 at 10 GHz
High thermal conductivity of 0.75 W/(m-K)
Low Z-axis coefficient of thermal expansion at 28 ppm/°C
High Tg greater than 280 °C TMA
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Rogers RO4360G2 are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-fi lled thermoset materials that provide the ideal balance of performance and processing ease. Rogers RO4360G2 PCB meterial extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multilayer RF PCB constructions, while reducing material and fabrication costs.
Rogers RO4360G2 process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design fl exibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4400 prepreg and lower-Dk RO4000 laminate in multilayer PCB designs.
Rogers RO4360G2, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications where size and cost are critical. RO4360G2 and RO4730G3 are the best value choice for engineers working on designs including power amplifi ers, patch antennas, ground-based radar, and other general RF applications.
