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Rogers(Arlon) ad250c, ad255c, ad260a microwave high frequency PCB materials are the third generation commercial microwave and RF laminates with low dielectric, low cost and excellent low loss characteristics.
Rogers(Arlon) ad250c, ad255c, ad260a microwave high frequency PCB materials, based on the cost-effective combination of composite chemistry and architecture, provide an unparalleled price performance ratio for today's telecommunications infrastructure.
Rogers(Arlon) ad250c, ad255c, ad260a microwave high frequency PCB materials combine the excellent thermal properties of fluoropolymer resin system with selected ceramic materials and glass fiber reinforced materials to obtain laminates with low loss (DF = 0.0014 at 10GHz), low thermal expansion properties and low passive intermodulation (PIM). In terms of cost, ad250c also represents the further improvement of Arlon Rogers ad250c, ad255c, ad260a microwave high frequency PCB products.
The stability of PTFE with low loss characteristics over a wide frequency and temperature range makes Rogers(Arlon) ad250c, ad255c, ad260a microwave high frequency PCB materials very suitable for various microwave and RF applications in telecommunications infrastructure. The addition of differential dispersion ceramics provides thermal stability in the form of lower CTE and higher temperature phase stability.
Rogers(Arlon) ad250c, Rogers ad255c, Rogers ad260a microwave high frequency PCB materials
The net combination of materials properties of Rogers ad250c, ad255c, ad260a microwave high frequency PCB is ideal for applications with high frequency and high gain and broadband signal material performance life expectancy, which generally exceeds the performance capabilities provided by low loss thermos bottles.
Rogers(Arlon) ad250c, ad255c, ad260a microwave high frequency PCB materials are compatible with the process of standard PTFE printed circuit board substrate. Its low z-axis thermal expansion improves the reliability of plated through-hole (PTH) compared to typical PTFE base platens. Low X-Y expansion improves the reliability of BGA Solder Joints.
Rogers(Arlon) ad250c, Rogers ad255c, Rogers ad260a microwave high frequency PCB B materials, Rogers ad series products combine fluoropolymer resin, specific ceramic filler and glass fiber support materials to produce a series of dielectric laminates with low loss, strong mechanical toughness, stable dielectric constant and low passive intermodulation (PIM).
Rogers(Arlon) ad250c, Rogers ad255c, Rogers ad260a microwave high frequency PCB materials is made of polytetrafluoroethylene and glass cloth with a loss factor of 0.0011. The board is soft and difficult to process;.
Product features
Strictly controlled dielectric constant (ad250c ± 0.04, ad255c, ad260a ± 0.04)
Low loss tangent at communication frequency (0.0014 at 10GHz)
The thermal conductivity is higher than that of traditional PTFE / glass fiber
The dielectric constant can be kept stable in a wide range of frequency and temperature
Reverse processing copper foil and im series copper foil have high peel strength and can be provided as conventional materials
advantage
A, High consistency of antenna performance. B, Low insertion loss and high antenna efficiency. C, Increased power capacity D, The performance of each frequency band is stable, and it is not sensitive to the weather E, PIM values as low as - 165dbc.
Typical applications
PCB for feed network of base station antenna and distributed antenna, Commercial antenna, Digital audio broadcasting (DAB), Patch antenna (GNSS, GPS, SDAR)
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