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2021-08-31
There are many packaging types for semiconductor devices, from DIP, SOP, QFP, PGA, BGA to CSP to SIP. The technical indicators are more advanced from generation to generation.
The impact of the integration trend of semiconductor packaging and pcb circuit board assembly on the electronics manufac...
According to all human inventions and creations, the crystal tubes and integrated circuits in the middle of the 20th cen...
The chip pcb is a large scale, microelectronic integrated circuit semiconductor.That is, the pcb printed circuit board that .
A semiconductor is a material, which refers to a material that has conductivity between a conductor and an insulator at room temperature.
The difference between IC carrier boards and PCB boards?
2021-08-29
BGA circuit boards, or Ball Grid Array (BGA) circuit boards, are a widely used packaging technology for modern electronic devices.
2021-08-28
IC packaging board refers to the process of processing the measured wafer according to the product model and function re...
2021-08-25
In the field of wireless communication, many different package integration solutions have been developed, includi...
1.BGA (ball grid array) ball contact display, one of the surface mount packages. On the back of the printed circuit boar...
Heterogeneous 3DIC still faces mass production thresholdAlthough the 3DIC+TSV three-dimensional stacking technology can...
IC packaging board technology has also been improved, THE application demand of IC industry is getting bigger and bigger, the integration is getting higher and higher
2021-08-24
This manuscript introduces COG (chip on glass) and COF (chip on flex) packaging technologies.
BGA pad is the contact part of the BGA package used to connect the chip solder balls with the PCB (printed circuit board).
2021-08-23
Sensor IC carrier boardSensor IC carrier boardProduct name: Sensor IC carrier boardBoard material: Shengyi SI10UMinimum ...
HDI IC package substratelga pcb (LGA IC package substrate)Product name: HDI IC package substrateBoard material: Mitsubis...
Flip chip,as the name suggests, is a packaging method in which the front side of the chip (the side where the IC circuit is made) is connected to the substrate downward.
Status of Advanced Substrates 2018: Embedded Dies & Interconnects, Substrates Like PCB Trends Apple has adopted...
Research on Control Strategy of Electric Vehicle Power System Based on Energy UtilizationProject introduction Aim...
