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2021-07-17
Storage IC packaging technology MCP, SOC, pop and sip differences
2021-07-16
Discussion on sip system in package Technology.
2021-07-15
With the rapid development of electronic technology, chip packaging technology is also progressing, SIP, POP and IGBT as an important form of packaging, its cleaning technology is particularly important.
2021-07-14
With the development of vlsi-pcb design and manufacturing technology, IC design enterprises have entered the SOC era.
2021-07-13
With the progress of MEMS IC packaging technology, inertial MEMS IC packaging sensor and medium angular frequency sensor are inertial components with high resolution and low cost, which are used to measure the yaw Angle and rotation roll rate of missile attitude.
MEMS(Micro Electromechanical System) microphone is a microphone based on MEMS technology.
2021-07-12
Introduction to Wafer Level Packaging Technology
IC PCB & Packaging- When talking about the future of wearable technology, the future course of wearable technology innovation is clear.
