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2021-10-06
Circuit board green manufacturing process (2) through-hole plating and copper platingIn the production of circuit boards...
In order to obtain a better and faster PCB, designers need to pay attention to three main areas when designing circuit b...
Green manufacturing process of circuit boards (1) Lead-free soldering of multilayer boardsIntroductionLead-containing so...
PCB manufacturer, IMC and tin whisker for lead-free soldering (2) Leaded and lead-free IMC1. Lead metal whose work is in...
What is the difference between gold plating and immersion gold process for PCB surface treatment
PCB process elaborate on the myth of Micro-USB structure and insufficient welding strengthI believe that many friends ha...
Circuit board test and selection1. Evaluation of the long-term reliability of the finished boardThe circuit board test m...
There are many types of pcb circuit boards, including single-sided pcb circuit boards, double-sided pcb circuit boards, ...
What matters should be paid attention to for PCB manufacturer, SMT steel mesh production and acceptance?The production o...
PCB process Shield frame design and production considerationsWhen I first came into contact with the shielding frame and...
Change of lead-free wave soldering unit for circuit board1. Brand new XichiIn order to avoid exceeding the upper limit o...
Circuit board manufacturers, fluxes for lead-free wave soldering of circuit boardsThe main function of the flux (F1uX) i...
Pollution of lead-free wave soldering of circuit boards1. Lead pollution causes solder joints to floatSince the CTE of t...
In electronic assembly, the printed circuit board is a key part. It is equipped with other electronic components and con...
The management process of lead-free soldering of circuit boards1. Avoid mixingDuring the transition period, the original...
System level packaging (SIP) is no longer a simple packaging technology, and these technologies include PoP, CoC, WLP, TSV, Embedded Substrate, etc. It also involves the development of other packaging processes such as wire bonding, flip chip, micro bumps, etc.
The special phenomenon of lead-free wave soldering of circuit boards1. QFP 2. Deterioration of heated solder joints(1) S...
Common disadvantages of lead-free wave soldering of circuit boards1. Selective wave solderingWhen there are only a few a...
PCB circuit board With the rapid development of the mobile phone, electronics, and communication industries, it has also...
Conductive hole via hole is also called via hole. In order to meet the requirements of users, the wire board through hol...
